RC28F160F3B95 datasheet, PDF - EEWORLD Datasheet

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RC28F160F3B95: DescriptionFlash, 512KX16, 95ns, PBGA64, BGA-64; Categorystorage storage; File Size1MB，48 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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RC28F160F3B95 Overview

Flash, 512KX16, 95ns, PBGA64, BGA-64

RC28F160F3B95 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	TBGA, BGA64,8X8,40
Contacts	64
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	95 ns
Other features	MIN 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK
startup block	BOTTOM
command user interface	YES
Data polling	NO
JESD-30 code	R-PBGA-B64
JESD-609 code	e0
length	13 mm
memory density	8388608 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	8,31
Number of terminals	64
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
page size	4 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/3.6,3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Department size	4K,32K
Maximum standby current	0.000075 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
type	NOR TYPE
width	10 mm
Base Number Matches	1

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RC28F160F3B95 Related Products

	RC28F160F3B95	DE28F800F3T115	DE28F800F3B115
Description	Flash, 512KX16, 95ns, PBGA64, BGA-64	Flash, 512KX16, 19ns, PDSO56, 16 X 23.70 MM, SSOP-56	Flash, 512KX16, 19ns, PDSO56, 16 X 23.70 MM, SSOP-56
Parts packaging code	BGA	SSOP	SSOP
package instruction	TBGA, BGA64,8X8,40	16 X 23.70 MM, SSOP-56	16 X 23.70 MM, SSOP-56
Contacts	64	56	56
Reach Compliance Code	unknow	unknow	unknow
ECCN code	EAR99	EAR99	EAR99
Maximum access time	95 ns	19 ns	19 ns
Other features	MIN 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK	MIN 100,000 BLOCK ERASE CYCLES; TOP BOOT BLOCK	MIN 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK
startup block	BOTTOM	TOP	BOTTOM
JESD-30 code	R-PBGA-B64	R-PDSO-G56	R-PDSO-G56
length	13 mm	23.7 mm	23.7 mm
memory density	8388608 bi	8388608 bi	8388608 bi
Memory IC Type	FLASH	FLASH	FLASH
memory width	16	16	16
Number of functions	1	1	1
Number of terminals	64	56	56
word count	524288 words	524288 words	524288 words
character code	512000	512000	512000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
organize	512KX16	512KX16	512KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TBGA	SSOP	SSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Programming voltage	2.7 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.9 mm	1.9 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	3 V	3 V
Nominal supply voltage (Vsup)	3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE
Terminal form	BALL	GULL WING	GULL WING
Terminal pitch	1 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	DUAL	DUAL
type	NOR TYPE	NOR TYPE	NOR TYPE
width	10 mm	13.3 mm	13.3 mm
Base Number Matches	1	1	1

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