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Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> MSP430G2413IN20
PDF

MSP430G2413IN20

Description
MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-PDIP -40 to 85
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB，76 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

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MSP430G2413IN20 Overview

MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-PDIP -40 to 85

MSP430G2413IN20 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeDIP
package instructionDIP, DIP20,.3
Contacts20
Reach Compliance Codecompli
Factory Lead Time6 weeks
Has ADCYES
Other featuresALSO OPERATES AT 1.8V AT 6 MHZ
Address bus width
bit size16
boundary scanYES
CPU seriesMSP430
maximum clock frequency16 MHz
DAC channelNO
DMA channelYES
External data bus width
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeR-PDIP-T20
JESD-609 codee4
length25.4 mm
low power modeYES
Humidity sensitivity level1
Number of DMA channels1
Number of I/O lines16
Number of serial I/Os1
Number of terminals20
Number of timers2
On-chip data RAM width8
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)260
power supply2/3.3 V
Certification statusNot Qualified
RAM (bytes)512
RAM (number of words)0.5
rom(word)8192
ROM programmabilityFLASH
Maximum seat height5.08 mm
speed16 MHz
Maximum slew rate0.42 mA
Maximum supply voltage3.6 V
Minimum supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC

MSP430G2413IN20 Related Products

MSP430G2413IN20 MSP430G2353IPW20R MSP430G2553IPW20 MSP430G2413IPW20 MSP430G2413IPW20R MSP430G2353IN20 MSP430G2313IN20 MSP430G2313IPW20
Description MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-PDIP -40 to 85 MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85 MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85 MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85 MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85 MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-PDIP -40 to 85 MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-PDIP -40 to 85 MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code DIP TSSOP TSSOP TSSOP TSSOP DIP DIP TSSOP
package instruction DIP, DIP20,.3 TSSOP, TSSOP20,.25 TSSOP-20 TSSOP, TSSOP20,.25 TSSOP, TSSOP20,.25 DIP-20 DIP-20 TSSOP, TSSOP20,.25
Contacts 20 20 20 20 20 20 20 20
Reach Compliance Code compli compli compliant compli compli compli compliant compli
Factory Lead Time 6 weeks 6 weeks 1 week 6 weeks 6 weeks 1 week 6 weeks 6 weeks
Has ADC YES YES YES YES NO YES YES YES
Other features ALSO OPERATES AT 1.8V AT 6 MHZ ALSO OPERATES AT 1.8V AT 6 MHZ ALSO OPERATES AT 1.8V AT 6 MHZ ALSO OPERATES AT 1.8V AT 6 MHZ ALSO OPERATES AT 1.8V AT 6 MHZ ALSO OPERATES AT 1.8V AT 6 MHZ ALSO OPERATES AT 1.8V AT 6 MHZ ALSO OPERATES AT 1.8V AT 6 MHZ
bit size 16 16 16 16 16 16 16 16
boundary scan YES YES YES YES YES YES YES YES
CPU series MSP430 MSP430 MSP430 MSP430 MSP430 MSP430 MSP430 MSP430
maximum clock frequency 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz
DAC channel NO NO NO NO NO NO NO NO
DMA channel YES YES YES YES YES YES YES YES
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache NO NO NO NO NO NO NO NO
JESD-30 code R-PDIP-T20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDIP-T20 R-PDIP-T20 R-PDSO-G20
JESD-609 code e4 e4 e4 e4 e4 e4 e4 e4
length 25.4 mm 6.5 mm 6.5 mm 6.5 mm 6.5 mm 25.4 mm 25.4 mm 6.5 mm
low power mode YES YES YES YES YES YES YES YES
Humidity sensitivity level 1 1 1 1 1 1 1 1
Number of DMA channels 1 1 1 1 1 1 1 1
Number of I/O lines 16 16 16 16 16 16 16 16
Number of serial I/Os 1 1 1 1 1 1 1 1
Number of terminals 20 20 20 20 20 20 20 20
Number of timers 2 2 2 2 2 2 2 2
On-chip data RAM width 8 8 8 8 8 8 8 8
On-chip program ROM width 8 8 8 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP TSSOP TSSOP TSSOP TSSOP DIP DIP TSSOP
Encapsulate equivalent code DIP20,.3 TSSOP20,.25 TSSOP20,.25 TSSOP20,.25 TSSOP20,.25 DIP20,.3 DIP20,.3 TSSOP20,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260
power supply 2/3.3 V 2/3.3 V 2/3.3 V 2/3.3 V 2/3.3 V 2/3.3 V 2/3.3 V 2/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 512 256 512 512 512 256 256 256
RAM (number of words) 0.5 0.25 0.5 0.5 0.5 0.25 0.25 0.25
rom(word) 8192 4096 16384 8192 8192 4096 4096 4096
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
Maximum seat height 5.08 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 5.08 mm 5.08 mm 1.2 mm
speed 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz
Maximum slew rate 0.42 mA 0.42 mA 0.42 mA 0.42 mA 0.42 mA 0.42 mA 0.42 mA 0.42 mA
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 2.54 mm 2.54 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 4.4 mm 4.4 mm 4.4 mm 4.4 mm 7.62 mm 7.62 mm 4.4 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC

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