GE28F640C3TC100 datasheet, PDF

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GE28F640C3TC100: DescriptionFlash, 4MX16, 100ns, PBGA48, CSP, VFBGA-48; Categorystorage storage; File Size485KB，76 Pages; ManufacturerNumonyx ( Micron ); Websitehttps://www.micron.com

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GE28F640C3TC100 Overview

Flash, 4MX16, 100ns, PBGA48, CSP, VFBGA-48

GE28F640C3TC100 Parametric

Parameter Name	Attribute value
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	48
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum access time	100 ns
Other features	USER-SELECTABLE 3V OR 12V VPP; TOP BOOT BLOCK
startup block	TOP
JESD-30 code	R-PBGA-B48
length	9 mm
memory density	67108864 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	48
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
width	7.7 mm
Base Number Matches	1

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3-Volt Advanced+ Boot Block Flash

Memory

28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)

Preliminary Datasheet

Product Features

•

Flexible SmartVoltage Technology

— 2.7 V–3.6 V Read/Program/Erase

— 12 V for Fast Production Programming

•

128-bit Protection Register

— 64-bit Unique Device Identifier

— 64-bit User Programmable OTP Cells

•

1.65 V–2.5 V or 2.7 V–3.6 V I/O Option

— Reduces Overall System Power

•

Extended Cycling Capability

— Minimum 100,000 Block Erase Cycles

•

High Performance

— 2.7 V–3.6 V: 70 ns Max Access Time

•

Supports Intel

Flash Data Integrator

Software

— Flash Memory Manager

— System Interrupt Manager

— Supports Parameter Storage, Streaming

Data (e.g., voice)

•

Optimized Architecture for Code Plus

Data Storage

— Eight 4-Kword Blocks, Top or Bottom

Locations

— Up to One Hundred-Twenty-Seven 32-

Kword Blocks

— Fast Program Suspend Capability

— Fast Erase Suspend Capability

•

Automated Word/Byte Program and

Block Erase

— Command User Interface

— Status Registers

•

Flexible Block Locking

— Lock/Unlock Any Block

— Full Protection on Power-Up

— WP# Pin for Hardware Block Protection

— V

= GND Option

— V

Lockout Voltage

•

Cross-Compatible Command Support

— Intel Basic Command Set

— Common Flash Interface

•

Standard Surface Mount Packaging

— 48-Ball CSP Packages

— 64-Ball Easy BGA Packages

— 48-Lead TSOP Package

•

Low Power Consumption

— 9 mA Typical Read Power

— 7 µ A Typical Standby Power with

Automatic Power Savings Feature

•

ETOX™ VIII (0.13

µm)

Flash

Technology

— 32- and 64-Mbit

•

12 V Fast Production Program

•

Extended Temperature Operation

— –40 °C to +85 °C

•

ETOX™ VII (0.18

µm)

Flash Technology

— 16-, 32-, 64-Mbit

•

ETOX™ VI (0.25

µm)

Flash Technology

— 8-, 16- and 32-Mbit

The 3-Volt Advanced+ Boot Block Flash memory, manufactured on Intel’s latest 0.13

µm

and

0.18

µm

technologies, represents a feature-rich solution for low-power applications. 3-Volt

Advanced+ Boot Block Flash memory devices incorporate low-voltage capability (2.7 V read,

program and erase) with high-speed, low-power operation. Flexible block locking allows any

Notice:

This document contains preliminary information on new products in production. The

specifications are subject to change without notice. Verify with your local Intel sales office that

you have the latest datasheet before finalizing a design.

Order Number: 290645-012

October 2001

block to be independently locked or unlocked. Add to this the Intel

Flash Data Integrator (IFDI)

software and you have a cost-effective, flexible, monolithic code plus data storage solution.

Intel

3-Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 48-ball CSP,

and 64-ball Easy BGA packages. Additional information on this product family can be obtained

by accessing the Intel

Flash website: http://www.intel.com/design/flash.

Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any

intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no

liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties

relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are

not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The 28F800C3, 28F160C3, 28F320C3, 28F640C3 may contain design defects or errors known as errata which may cause the product to deviate from

published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-

548-4725 or by visiting Intel's website at http://www.intel.com.

*Other names and brands may be claimed as the property of others.

Preliminary

28F800C3, 28F160C3, 28F320C3, 28F640C3

Contents

1.0

2.0

Introduction

.................................................................................................................. 1

1.1

Product Overview .................................................................................................. 2

Product Description

.................................................................................................. 3

2.1

2.2

Package Pinouts ...................................................................................................3

Block Organization ................................................................................................ 9

2.2.1 Parameter Blocks ..................................................................................... 9

2.2.2 Main Blocks ..............................................................................................9

3.0

Principles of Operation

............................................................................................9

3.1

Bus Operation ....................................................................................................... 9

3.1.1 Read ......................................................................................................... 9

3.1.2 Output Disable........................................................................................ 10

3.1.3 Standby .................................................................................................. 10

3.1.4 Reset ...................................................................................................... 10

3.1.5 Write ....................................................................................................... 11

Modes of Operation............................................................................................. 11

3.2.1 Read Array ............................................................................................. 11

3.2.2 Read Configuration ................................................................................ 12

3.2.3 Read Status Register ............................................................................. 12

3.2.4 Read Query ............................................................................................13

3.2.5 Program Mode........................................................................................ 13

3.2.6 Erase Mode ............................................................................................14

Flexible Block Locking......................................................................................... 17

3.3.1 Locking Operation .................................................................................. 18

3.3.2 Unlocked State ....................................................................................... 18

3.3.3 Lock-Down State .................................................................................... 18

3.3.4 Reading Block-Lock Status .................................................................... 19

3.3.5 Locking Operations during Erase Suspend ............................................ 19

3.3.6 Status Register Error Checking .............................................................. 19

128-Bit Protection Register ................................................................................. 20

3.4.1 Reading the Protection Register ............................................................ 20

3.4.2 Programming the Protection Register ....................................................21

3.4.3 Locking the Protection Register ............................................................. 21

Program and Erase Voltages .......................................................................21

3.5.1 Improved 12-Volt Production Programming ........................................... 21

3.5.2 VPP £ VPPLK for Complete Protection .................................................. 22

Power Consumption ............................................................................................22

3.6.1 Active Power (Program/Erase/Read) ..................................................... 23

3.6.2 Automatic Power Savings (APS) ............................................................ 23

3.6.3 Standby Power ....................................................................................... 23

3.6.4 Deep Power-Down Mode .......................................................................23

Power-Up/Down Operation ................................................................................. 23

3.7.1 RP# Connected to System Reset...........................................................24

3.7.2 VCC, VPP and RP# Transitions ............................................................. 24

Power Supply Decoupling ................................................................................... 24

3.2

3.3

3.4

3.5

3.6

3.7

3.8

Preliminary

iii

28F800C3, 28F160C3, 28F320C3, 28F640C3

4.0

Electrical Specifications

........................................................................................ 25

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

Absolute Maximum Ratings ................................................................................ 25

Operating Conditions .......................................................................................... 26

Capacitance ........................................................................................................ 26

DC Characteristics .............................................................................................. 27

AC Characteristics—Read Operations................................................................ 31

AC Characteristics—Write Operations ................................................................ 36

Erase and Program Timings ............................................................................... 40

Reset Operations ................................................................................................ 42

5.0

6.0

Ordering Information

.............................................................................................. 43

Additional Information

........................................................................................... 45

WSM Current/Next States, Sheet 1 of 2

..................................................... 46

Program/Erase Flowcharts

............................................................................. 48

Common Flash Interface Query Structure

............................................... 54

Architecture Block Diagram

........................................................................... 61

Word-Wide Memory Map Diagrams

............................................................. 62

Device ID Table

.................................................................................................... 66

Protection Register Addressing

................................................................... 67

Preliminary

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