TMS320DM355DZCE270 datasheet, PDF

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TMS320DM355DZCE270: DescriptionDigital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，163 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TMS320DM355DZCE270 Overview

Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85

TMS320DM355DZCE270 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	LFBGA, BGA337,19X19,25
Contacts	337
Reach Compliance Code	compli
Factory Lead Time	1 week
Samacsys Descripti	Digital Media System-on-Chi
Other features	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O
bit size	32
Bus compatibility	I2C; SPI; UART; USB
External data bus width	32
Format	FIXED POINT
JESD-30 code	S-PBGA-B337
JESD-609 code	e1
length	13 mm
Humidity sensitivity level	3
Number of terminals	337
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA337,19X19,25
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.3,1.8,3.3 V
Certification status	Not Qualified
RAM (number of words)	8192
Maximum seat height	1.3 mm
Maximum supply voltage	1.365 V
Minimum supply voltage	1.235 V
Nominal supply voltage	1.3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.65 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

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Description	Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85	Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85	Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85	Digital Media System-on-Chip (DMSoC) 337-NFBGA -40 to 100	Digital Media System-on-Chip (DMSoC) 337-NFBGA -40 to 100	Digital Media System-on-Chip (DMSoC) 337-NFBGA	Digital Media System-on-Chip (DMSoC) 337-NFBGA	Digital Signal Processors & Controllers - DSP, DSC Dig Media System-on- Chip
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	conform to	conform to	conform to	incompatible	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	LFBGA, BGA337,19X19,25	LFBGA, BGA337,19X19,25	LFBGA, BGA337,19X19,25	LFBGA, BGA337,19X19,25	LFBGA, BGA337,19X19,25	LFBGA, BGA337,19X19,25	LFBGA, BGA337,19X19,25	LFBGA, BGA337,19X19,25
Contacts	337	337	337	337	337	337	337	337
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	unknow
Other features	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O
bit size	32	32	32	32	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
JESD-30 code	S-PBGA-B337	S-PBGA-B337	S-PBGA-B337	S-PBGA-B337	S-PBGA-B337	S-PBGA-B337	S-PBGA-B337	S-PBGA-B337
JESD-609 code	e1	e1	e1	e1	e1	e1	e1	e1
length	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
Humidity sensitivity level	3	3	3	3	3	3	3	3
Number of terminals	337	337	337	337	337	337	337	337
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA
Encapsulate equivalent code	BGA337,19X19,25	BGA337,19X19,25	BGA337,19X19,25	BGA337,19X19,25	BGA337,19X19,25	BGA337,19X19,25	BGA337,19X19,25	BGA337,19X19,25
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260
power supply	1.3,1.8,3.3 V	1.3,1.8,3.3 V	1.3,1.8,3.3 V	1.3,1.8,3.3 V	1.3,1.8,3.3 V	1.3,1.8,3.3 V	1.3,1.8,3.3 V	1.3,1.8,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	8192	8192	8192	8192	8192	8192	8192	8192
Maximum seat height	1.3 mm	1.3 mm	1.3 mm	1.3 mm	1.3 mm	1.3 mm	1.3 mm	1.3 mm
Maximum supply voltage	1.365 V	1.365 V	1.365 V	1.365 V	1.365 V	1.365 V	1.365 V	1.365 V
Minimum supply voltage	1.235 V	1.235 V	1.235 V	1.235 V	1.235 V	1.235 V	1.235 V	1.235 V
Nominal supply voltage	1.3 V	1.3 V	1.3 V	1.3 V	1.3 V	1.3 V	1.3 V	1.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
Is it lead-free?	Lead free	Lead free	Lead free	-	Lead free	Lead free	Lead free	Contains lead
Factory Lead Time	1 week	1 week	6 weeks	6 weeks	6 weeks	1 week	6 weeks	-
Bus compatibility	I2C; SPI; UART; USB	I2C; SPI; UART; USB	I2C; SPI; UART; USB	I2C; SPI; UART; USB	I2C; SPI; UART; USB	I2C; SPI; UART; USB	I2C; SPI; UART; USB	-
External data bus width	32	32	32	32	32	32	32	-
Maximum operating temperature	85 °C	85 °C	85 °C	100 °C	100 °C	85 °C	100 °C	-
Temperature level	OTHER	OTHER	OTHER	INDUSTRIAL	INDUSTRIAL	OTHER	INDUSTRIAL	-

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