|
TNETV2685FIDZUT11 |
TMS320DM647ZUT1 |
TMS320DM648CUTD1 |
TMS320DM648ZUTD1 |
TMS320DM648CUT1 |
TNETV2685VIDZUT11 |
TNETV2685ZUT11 |
TNETV2685FIBZUT11 |
| Description |
Digital Media Processor 529-FCBGA 0 to 90 |
Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc |
Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc |
Digital Signal Processors & Controllers - DSP, DSC Digital Media Proc |
Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc |
Digital Media Processor 529-FCBGA 0 to 90 |
Digital Media Processor 529-FCBGA 0 to 90 |
Digital Media Processor 529-FCBGA 0 to 90 |
| Brand Name |
Texas Instruments |
Texas Instruments |
- |
- |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
incompatible |
conform to |
- |
- |
- |
incompatible |
incompatible |
incompatible |
| package instruction |
FBGA, |
FBGA, BGA529,23X23,32 |
- |
- |
- |
FBGA, |
FBGA, |
FBGA, |
| Reach Compliance Code |
not_compliant |
unknow |
- |
- |
- |
not_compliant |
not_compliant |
not_compliant |
| Address bus width |
14 |
32 |
- |
- |
- |
14 |
14 |
14 |
| barrel shifter |
NO |
NO |
- |
- |
- |
NO |
NO |
NO |
| boundary scan |
YES |
YES |
- |
- |
- |
YES |
YES |
YES |
| External data bus width |
32 |
32 |
- |
- |
- |
32 |
32 |
32 |
| Format |
FIXED POINT |
FIXED POINT |
- |
- |
- |
FIXED POINT |
FIXED POINT |
FIXED POINT |
| Internal bus architecture |
MULTIPLE |
MULTIPLE |
- |
- |
- |
MULTIPLE |
MULTIPLE |
MULTIPLE |
| JESD-30 code |
S-PBGA-B520 |
S-PBGA-B529 |
- |
- |
- |
S-PBGA-B520 |
S-PBGA-B520 |
S-PBGA-B520 |
| JESD-609 code |
e1 |
e1 |
- |
- |
- |
e1 |
e1 |
e1 |
| length |
19 mm |
19 mm |
- |
- |
- |
19 mm |
19 mm |
19 mm |
| low power mode |
YES |
YES |
- |
- |
- |
YES |
YES |
YES |
| Humidity sensitivity level |
4 |
4 |
- |
- |
- |
4 |
4 |
4 |
| Number of terminals |
520 |
529 |
- |
- |
- |
520 |
520 |
520 |
| Maximum operating temperature |
90 °C |
90 °C |
- |
- |
- |
90 °C |
90 °C |
90 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
- |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
FBGA |
FBGA |
- |
- |
- |
FBGA |
FBGA |
FBGA |
| Package shape |
SQUARE |
SQUARE |
- |
- |
- |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
- |
- |
- |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
245 |
245 |
- |
- |
- |
245 |
245 |
245 |
| Maximum seat height |
3.3 mm |
3.3 mm |
- |
- |
- |
3.3 mm |
3.3 mm |
3.3 mm |
| Maximum supply voltage |
1.26 V |
1.26 V |
- |
- |
- |
1.26 V |
1.26 V |
1.26 V |
| Minimum supply voltage |
1.14 V |
1.14 V |
- |
- |
- |
1.14 V |
1.14 V |
1.14 V |
| Nominal supply voltage |
1.2 V |
1.2 V |
- |
- |
- |
1.2 V |
1.2 V |
1.2 V |
| surface mount |
YES |
YES |
- |
- |
- |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
- |
- |
- |
CMOS |
CMOS |
CMOS |
| Temperature level |
OTHER |
OTHER |
- |
- |
- |
OTHER |
OTHER |
OTHER |
| Terminal surface |
TIN SILVER COPPER |
Tin/Silver/Copper (Sn/Ag/Cu) |
- |
- |
- |
TIN SILVER COPPER |
TIN SILVER COPPER |
TIN SILVER COPPER |
| Terminal form |
BALL |
BALL |
- |
- |
- |
BALL |
BALL |
BALL |
| Terminal pitch |
0.8 mm |
0.8 mm |
- |
- |
- |
0.8 mm |
0.8 mm |
0.8 mm |
| Terminal location |
BOTTOM |
BOTTOM |
- |
- |
- |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
30 |
NOT SPECIFIED |
- |
- |
- |
30 |
30 |
30 |
| width |
19 mm |
19 mm |
- |
- |
- |
19 mm |
19 mm |
19 mm |
| uPs/uCs/peripheral integrated circuit type |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
- |
- |
- |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |