IC,SIMPLE-PLD,PAL-TYPE,TTL,LLCC,28PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Reach Compliance Code | not_compliant |
| Architecture | PAL-TYPE |
| JESD-30 code | S-XQCC-N28 |
| Number of entries | 19 |
| Output times | 8 |
| Number of product terms | 64 |
| Number of terminals | 28 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output function | REGISTERED |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC28,.45SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programmable logic type | OT PLD |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| TIBPALR19R4MFKB | TIBPALR19L8MFKB | TIBPALR19R6MJWB | TIBPALR19R6MFKB | TIBPALR19R8MJWB | TIBPALR19R8MFKB | TIBPALR19R4MJWB | TIBPALR19L8MJWB | |
|---|---|---|---|---|---|---|---|---|
| Description | IC,SIMPLE-PLD,PAL-TYPE,TTL,LLCC,28PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,TTL,LLCC,28PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,TTL,DIP,24PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,TTL,LLCC,28PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,TTL,DIP,24PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,TTL,LLCC,28PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,TTL,DIP,24PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,TTL,DIP,24PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| Architecture | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| JESD-30 code | S-XQCC-N28 | S-XQCC-N28 | R-XDIP-T24 | S-XQCC-N28 | R-XDIP-T24 | S-XQCC-N28 | R-XDIP-T24 | R-XDIP-T24 |
| Number of entries | 19 | 19 | 19 | 19 | 19 | 19 | 19 | 19 |
| Output times | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of product terms | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Number of terminals | 28 | 28 | 24 | 28 | 24 | 28 | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output function | REGISTERED | COMBINATORIAL | REGISTERED | REGISTERED | REGISTERED | REGISTERED | REGISTERED | COMBINATORIAL |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QCCN | QCCN | DIP | QCCN | DIP | QCCN | DIP | DIP |
| Encapsulate equivalent code | LCC28,.45SQ | LCC28,.45SQ | DIP24,.6 | LCC28,.45SQ | DIP24,.6 | LCC28,.45SQ | DIP24,.6 | DIP24,.6 |
| Package shape | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programmable logic type | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES | NO | YES | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| package instruction | - | QCCN, LCC28,.45SQ | DIP, DIP24,.6 | QCCN, LCC28,.45SQ | DIP, DIP24,.6 | QCCN, LCC28,.45SQ | - | DIP, DIP24,.6 |
京公网安备 11010802033920号
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