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ADG819BRM-REEL7

Description
IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO8, MICRO, SOIC-8, Multiplexer or Switch
CategoryAnalog mixed-signal IC    The signal circuit   
File Size186KB,12 Pages
ManufacturerADI
Websitehttps://www.analog.com
Download Datasheet Parametric Compare View All

ADG819BRM-REEL7 Overview

IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO8, MICRO, SOIC-8, Multiplexer or Switch

ADG819BRM-REEL7 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerADI
Parts packaging codeSOIC
package instructionMICRO, SOIC-8
Contacts8
Reach Compliance Codenot_compliant
ECCN codeEAR99
Analog Integrated Circuits - Other TypesSPDT
JESD-30 codeS-PDSO-G8
JESD-609 codee0
length3 mm
Humidity sensitivity level1
Number of channels1
Number of functions1
Number of terminals8
Nominal off-state isolation71 dB
On-state resistance matching specifications0.06 Ω
Maximum on-state resistance (Ron)1.4 Ω
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.19
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)240
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1.09 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)3 V
surface mountYES
Maximum disconnect time16 ns
Maximum connection time60 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3 mm
a
0.5 CMOS
1.8 V to 5.5 V 2:1 Mux/SPDT Switches
ADG819/ADG820
FUNCTIONAL BLOCK DIAGRAM
ADG819/
ADG820
S2
D
S1
IN
SWITCHES SHOWN
FOR A LOGIC “1” INPUT
FEATURES
Low On Resistance 0.8 Max at 125 C
0.25 Max On Resistance Flatness
1.8 V to 5.5 V Single Supply
200 mA Current Carrying Capability
Automotive Temperature Range: –40 C to +125 C
Rail-to-Rail Operation
6-Lead SOT-23 Package, 8-Lead SOIC Package, and
6-Bump MicroCSP (Micro Chip Scale Package) ADG819
Fast Switching Times
Typical Power Consumption (<0.01 W)
TTL-/CMOS-Compatible Inputs
Pin Compatible with the ADG719 (ADG819)
APPLICATIONS
Power Routing
Battery-Powered Systems
Communication Systems
Data Acquisition Systems
Cellular Phones
Modems
PCMCIA Cards
Hard Drives
Relay Replacement
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG819 and the ADG820 are monolithic, CMOS, SPDT
(single-pole, double-throw) switches. These switches are designed
on a submicron process that provides low power dissipation yet
gives high switching speed, low On resistance, and low leakage
currents.
Low power consumption and an operating supply range of 1.8 V
to 5.5 V make the ADG819 and ADG820 ideal for battery-pow-
ered, portable instruments.
Each switch of the ADG819 and the ADG820 conducts equally
well in both directions when on. The ADG819 exhibits break-
before-make switching action, thus preventing momentary shorting
when switching channels. The ADG820 exhibits make-before-
break action.
The ADG819 and the ADG820 are available in a 6-lead SOT-23
package and an 8-lead
µSOIC
package. The ADG819 is also
available in a 2
×
3 bump 1.14 mm
×
2.18 mm MicroCSP
package. This chip occupies only a 1.14 mm
×
2.18 mm area,
making it the ideal candidate for space-constrained applications.
1. Very low ON resistance, 0.5
typical
2. 1.8 V to 5.5 V single-supply operation
3. High current carrying capability
4. Tiny 6-lead SOT-23 package, 8-lead
µSOIC
package,
and 2
×
3 bump 1.14 mm
×
2.18 mm MicroCSP package
(ADG819 only)
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2002

ADG819BRM-REEL7 Related Products

ADG819BRM-REEL7 ADG820BRT-REEL7 ADG820BRM-REEL7 ADG820BRM-REEL ADG820BRMZ ADG820BRM-R2 ADG819BRM-R2 ADG820BRTZ-REEL7 ADG820BRTZ-REEL
Description IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO8, MICRO, SOIC-8, Multiplexer or Switch IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO6, PLASTIC, SOT-23, 6 PIN, Multiplexer or Switch IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO8, MICRO, SOIC-8, Multiplexer or Switch IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO8, MICRO, SOIC-8, Multiplexer or Switch IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO8, MICRO, SOIC-8, Multiplexer or Switch IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO8, MICRO, SOIC-8, Multiplexer or Switch IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO8, MICRO, SOIC-8, Multiplexer or Switch IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO6, PLASTIC, SOT-23, 6 PIN, Multiplexer or Switch IC 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO6, PLASTIC, SOT-23, 6 PIN, Multiplexer or Switch
Is it Rohs certified? incompatible incompatible incompatible incompatible conform to incompatible incompatible conform to conform to
Maker ADI ADI ADI ADI ADI ADI ADI ADI ADI
Parts packaging code SOIC SOT-23 SOIC SOIC SOIC SOIC SOIC SOT-23 SOT-23
package instruction MICRO, SOIC-8 PLASTIC, SOT-23, 6 PIN MICRO, SOIC-8 MICRO, SOIC-8 MICRO, SOIC-8 MICRO, SOIC-8 MICRO, SOIC-8 LSSOP, PLASTIC, SOT-23, 6 PIN
Contacts 8 6 8 8 8 8 8 6 6
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant compliant not_compliant not_compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Analog Integrated Circuits - Other Types SPDT SPDT SPDT SPDT SPDT SPDT SPDT SPDT SPDT
JESD-30 code S-PDSO-G8 R-PDSO-G6 S-PDSO-G8 S-PDSO-G8 S-PDSO-G8 S-PDSO-G8 S-PDSO-G8 R-PDSO-G6 R-PDSO-G6
JESD-609 code e0 e0 e0 e0 e3 e0 e0 e3 e3
length 3 mm 2.9 mm 3 mm 3 mm 3 mm 3 mm 3 mm 2.9 mm 2.9 mm
Humidity sensitivity level 1 1 1 1 1 1 1 1 1
Number of channels 1 1 1 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 8 6 8 8 8 8 8 6 6
Nominal off-state isolation 71 dB 71 dB 71 dB 71 dB 71 dB 71 dB 71 dB 71 dB 71 dB
On-state resistance matching specifications 0.06 Ω 0.06 Ω 0.06 Ω 0.06 Ω 0.06 Ω 0.06 Ω 0.06 Ω 0.06 Ω 0.06 Ω
Maximum on-state resistance (Ron) 1.4 Ω 1.4 Ω 1.4 Ω 1.4 Ω 1.4 Ω 1.4 Ω 1.4 Ω 1.4 Ω 1.4 Ω
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP LSSOP TSSOP TSSOP TSSOP TSSOP TSSOP LSSOP LSSOP
Package shape SQUARE RECTANGULAR SQUARE SQUARE SQUARE SQUARE SQUARE RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 240 240 240 240 260 240 NOT SPECIFIED 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.09 mm 1.45 mm 1.09 mm 1.09 mm 1.09 mm 1.09 mm 1.09 mm 1.45 mm 1.45 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES YES YES YES
Maximum disconnect time 16 ns 45 ns 45 ns 45 ns 45 ns 45 ns 16 ns 45 ns 45 ns
Maximum connection time 60 ns 35 ns 35 ns 35 ns 35 ns 35 ns 60 ns 35 ns 35 ns
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Matte Tin (Sn) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.95 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.95 mm 0.95 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 40 30 NOT SPECIFIED 40 40
width 3 mm 1.65 mm 3 mm 3 mm 3 mm 3 mm 3 mm 1.6 mm 1.6 mm
Encapsulate equivalent code TSSOP8,.19 TSOP6,.11,37 TSSOP8,.19 TSSOP8,.19 - TSSOP8,.19 TSSOP8,.19 - -
power supply 3/5 V 3/5 V 3/5 V 3/5 V - 3/5 V 3/5 V - -
switch BREAK-BEFORE-MAKE MAKE-BEFORE-BREAK MAKE-BEFORE-BREAK MAKE-BEFORE-BREAK - MAKE-BEFORE-BREAK BREAK-BEFORE-MAKE - -
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