a
0.5 CMOS
1.8 V to 5.5 V 2:1 Mux/SPDT Switches
ADG819/ADG820
FUNCTIONAL BLOCK DIAGRAM
ADG819/
ADG820
S2
D
S1
IN
SWITCHES SHOWN
FOR A LOGIC “1” INPUT
FEATURES
Low On Resistance 0.8 Max at 125 C
0.25 Max On Resistance Flatness
1.8 V to 5.5 V Single Supply
200 mA Current Carrying Capability
Automotive Temperature Range: –40 C to +125 C
Rail-to-Rail Operation
6-Lead SOT-23 Package, 8-Lead SOIC Package, and
6-Bump MicroCSP (Micro Chip Scale Package) ADG819
Fast Switching Times
Typical Power Consumption (<0.01 W)
TTL-/CMOS-Compatible Inputs
Pin Compatible with the ADG719 (ADG819)
APPLICATIONS
Power Routing
Battery-Powered Systems
Communication Systems
Data Acquisition Systems
Cellular Phones
Modems
PCMCIA Cards
Hard Drives
Relay Replacement
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG819 and the ADG820 are monolithic, CMOS, SPDT
(single-pole, double-throw) switches. These switches are designed
on a submicron process that provides low power dissipation yet
gives high switching speed, low On resistance, and low leakage
currents.
Low power consumption and an operating supply range of 1.8 V
to 5.5 V make the ADG819 and ADG820 ideal for battery-pow-
ered, portable instruments.
Each switch of the ADG819 and the ADG820 conducts equally
well in both directions when on. The ADG819 exhibits break-
before-make switching action, thus preventing momentary shorting
when switching channels. The ADG820 exhibits make-before-
break action.
The ADG819 and the ADG820 are available in a 6-lead SOT-23
package and an 8-lead
µSOIC
package. The ADG819 is also
available in a 2
×
3 bump 1.14 mm
×
2.18 mm MicroCSP
package. This chip occupies only a 1.14 mm
×
2.18 mm area,
making it the ideal candidate for space-constrained applications.
1. Very low ON resistance, 0.5
Ω
typical
2. 1.8 V to 5.5 V single-supply operation
3. High current carrying capability
4. Tiny 6-lead SOT-23 package, 8-lead
µSOIC
package,
and 2
×
3 bump 1.14 mm
×
2.18 mm MicroCSP package
(ADG819 only)
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2002
ADG819/ADG820–SPECIFICATIONS
1
(V
Parameter
ANALOG SWITCH
Analog Signal Range
ON Resistance (R
ON
)
ON Resistance Match Between
Channels (∆R
ON
)
ON Resistance Flatness (R
FLAT(ON)
)
LEAKAGE CURRENTS
Source OFF Leakage I
S
(OFF)
Channel ON Leakage I
D
, I
S
(ON)
DIGITAL INPUTS
Input High Voltage, V
INH
Input Low Voltage, V
INL
Input Current
I
INL
or I
INH
C
IN,
Digital Input Capacitance
DYNAMIC CHARACTERISTICS
3
ADG819
t
ON
t
OFF
Break-Before-Make Time Delay, t
BBM
ADG820
t
ON
t
OFF
Make-Before-Break Time Delay, t
MBB
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Bandwidth –3 dB
C
S
(OFF)
C
D,
C
S
(ON)
POWER REQUIREMENTS
I
DD
NOTES
1
Temperature range is as follows: –40°C to +125°C.
2
ON resistance parameters tested with I
S
= 10 mA.
3
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
DD
=
5V
10%, GND = 0 V.)
Unit
V
Ω
typ
Ω
max
Ω
typ
Ω
max
Ω
typ
Ω
max
nA typ
nA max
nA typ
nA max
V min
V max
µA
typ
µA
max
pF typ
V
IN
= V
INL
or V
INH
Test Conditions/Comments
25 C
–40 C to –40 C to
+85 C
+125 C
2
0 V to V
DD
0.5
0.6
0.06
0.08
0.1
0.17
±
0.01
±
0.25
±
0.01
±
0.25
0.7
0.8
V
S
= 0 V to V
DD
, I
S
= 100 mA;
Test Circuit 1
V
S
= 0 V to V
DD
, I
S
= 100 mA
V
S
= 0 V to V
DD
, I
S
= 100 mA
V
DD
= 5.5 V
V
S
= 4.5 V/1 V, V
D
= 1 V/4.5 V;
Test Circuit 2
V
S
= V
D
= 1 V, or V
S
= V
D
= 4.5 V;
Test Circuit 3
0.1
0.2
0.12
0.25
±
3
±
3
±
10
±
25
2.0
0.8
0.005
±
0.1
5
35
45
10
16
5
50
18
55
21
1
ns typ
ns max
ns typ
ns max
ns typ
ns min
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
MHz typ
pF typ
pF typ
R
L
= 50
Ω,
C
L
= 35 pF,
V
S
= 3 V; Test Circuit 4
R
L
= 50
Ω,
C
L
= 35 pF,
V
S
= 3 V; Test Circuit 4
R
L
= 50
Ω,
C
L
= 35 pF,
V
S1
= V
S2
= 3 V; Test Circuit 5
R
L
= 50
Ω,
C
L
= 35 pF,
V
S
= 3 V; Test Circuit 4
R
L
= 50
Ω,
C
L
= 35 pF,
V
S
= 3 V; Test Circuit 4
R
L
= 50
Ω,
C
L
= 35 pF,
V
S
= 0 V; Test Circuit 6
V
S
= 2.5 V, R
S
= 0
Ω,
C
L
= 1 nF;
Test Circuit 7
R
L
= 50
Ω,
C
L
= 5 pF, f = 100 kHz;
Test Circuit 8
R
L
= 50
Ω,
C
L
= 5 pF, f = 100 kHz;
Test Circuit 10
R
L
= 50
Ω,
C
L
= 5 pF; Test Circuit 9
f = 1 MHz
f = 1 MHz
V
DD
= 5.5 V
Digital Inputs = 0 V or 5.5 V
10
18
26
40
15
20
–71
–72
17
80
300
20
45
22
50
1
0.001
1.0
2.0
µA
typ
µA
max
–2–
REV. 0
ADG819/ADG820
SPECIFICATIONS
(V
Parameter
ANALOG SWITCH
Analog Signal Range
ON Resistance (R
ON
)
ON Resistance Match Between
Channels (∆R
ON
)
1
DD
= 2.7 V to 3.6 V, GND = 0 V.)
25 C
–40 C to –40 C to
+85 C
+125 C
2
0 V to V
DD
0.7
1.4
0.06
0.13
0.13
0.25
±
0.01
±
0.25
±
0.01
±
0.25
1.5
1.6
Unit
V
Ω
typ
Ω
max
Ω
typ
Ω
max
Ω
typ
nA typ
nA max
nA typ
nA max
V min
V max
µA
typ
µA
max
pF typ
V
IN
= V
INL
or V
INH
Test Conditions/Comments
V
S
= 0 V to V
DD
, I
S
= 100 mA;
Test Circuit 1
V
S
= 0 V to V
DD
, I
S
= 100 mA
V
S
= 0 V to V
DD
, I
S
= 100 mA
V
DD
= 3.6 V
V
S
= 3.3 V/1 V, V
D
= 1 V/3.3 V;
Test Circuit 2
V
S
= V
D
= 1 V, or V
S
= V
D
= 3.3 V;
Test Circuit 3
ON Resistance Flatness (R
FLAT(ON)
)
LEAKAGE CURRENTS
Source OFF Leakage I
S
(OFF)
Channel ON Leakage I
D
, I
S
(ON)
DIGITAL INPUTS
Input High Voltage, V
INH
Input Low Voltage, V
INL
Input Current
I
INL
or I
INH
C
IN,
Digital Input Capacitance
DYNAMIC CHARACTERISTICS
3
ADG819
t
ON
t
OFF
Break-Before-Make Time Delay, t
BBM
ADG820
t
ON
t
OFF
Make-Before-Break Time Delay, t
MBB
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Bandwidth –3 dB
C
S
(OFF)
C
D
, C
S
(ON)
POWER REQUIREMENTS
I
DD
NOTES
1
Temperature range is as follows: –40°C to +125°C.
2
ON resistance parameters tested with I
S
= 10 mA.
3
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
±
3
±
3
±
10
±
25
2.0
0.8
0.005
±
0.1
5
40
60
10
16
40
65
18
70
21
1
ns typ
ns max
ns typ
ns max
ns typ
ns min
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
MHz typ
pF typ
pF typ
R
L
= 50
Ω,
C
L
= 35 pF,
V
S
= 1.5 V; Test Circuit 4
R
L
= 50
Ω,
C
L
= 35 pF,
V
S
= 1.5 V; Test Circuit
R
L
= 50
Ω,
C
L
= 35 pF,
V
S1
= V
S2
= 1.5 V; Test Circuit 5
R
L
= 50
Ω,
C
L
= 35 pF,
V
S
= 1.5 V; Test Circuit 4
R
L
= 50
Ω,
C
L
= 35 pF,
V
S
= 1.5 V; Test Circuit 4
R
L
= 50
Ω,
C
L
= 35 pF,
V
S
= 1.5 V; Test Circuit 6
V
S
= 1.5 V, R
S
= 0
Ω,
C
L
= 1 nF;
Test Circuit 7
R
L
= 50
Ω,
C
L
= 5 pF, f = 100 kHz;
Test Circuit 8
R
L
= 50
Ω,
C
L
= 5 pF, f = 100 kHz;
Test Circuit 10
R
L
= 50
Ω,
C
L
= 5 pF; Test Circuit 9
f = 1 MHz
f = 1 MHz
V
DD
= 3.6 V
Digital Inputs = 0 V or 3.6 V
20
35
30
45
10
10
–71
–72
17
80
300
40
50
45
55
1
0.001
1.0
2.0
µA
typ
µA
max
REV. 0
–3–
ADG819/ADG820
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25°C, unless otherwise noted.)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Inputs
2
. . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Digital Inputs
2
. . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
. . . . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . 200 mA
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Automotive . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
µSOIC
Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W
SOT-23 Package (4-Layer Board)
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 119°C/W
MicroCSP Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . TBD
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . 235°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. Truth Table for the ADG819/ADG820
IN
0
1
Switch S1
ON
OFF
Switch S2
OFF
ON
PIN CONFIGURATIONS
6-Lead SOT-23
(RT-6)
8-Lead
µSOIC
(RM-8)
2
3 MicroCSP
TOP VIEW
(BUMPS AT THE BOTTOM)
NOT TO SCALE
IN
1
V
DD 2
6
S2
ADG819/
ADG820
D
1
S1
2
GND
3
8
S2
5
D
TOP VIEW
GND
3
(Not to Scale)
4
S1
ADG819/
ADG820
TOP VIEW
(Not to Scale)
S2
1
IN
6
7
NC
6
IN
5
NC
D
2
V
DD
5
V
DD 4
S1
NC = NO CONNECT
3
GND
4
ADG819 ONLY
ORDERING GUIDE
Model Option
ADG819BRM
ADG819BRT
ADG819BCB
ADG820BRM
ADG820BRT
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +85°C
–40°C to +125°C
–40°C to +125°C
Brand
1
SNB
SNB
SNB
SPB
SPB
Package Description
µSOIC
(MicroSmall Outline IC)
SOT-23 (Plastic Surface-Mount)
MicroCSP (Micro Chip Scale Package)
µSOIC
(MicroSmall Outline IC)
SOT-23 (Plastic Surface-Mount)
Package
RM-8
RT-6
2
CB-6
2
RM-8
RT-6
2
NOTES
1
Branding on these packages is limited to three characters due to space constraints.
2
Contact factory for availability.
–4–
REV. 0
ADG819/ADG820
TERMINOLOGY
V
DD
GND
I
DD
S
D
IN
R
ON
∆R
ON
R
FLAT(ON)
I
S
(OFF)
I
D
, I
S
(ON)
V
D
(V
S
)
V
INL
V
INH
I
INL
(I
INH
)
C
S
(OFF)
C
D
, C
S
(ON)
t
ON
t
OFF
t
BBM
t
MBB
Charge Injection
Crosstalk
OFF Isolation
Bandwidth
ON Response
Insertion Loss
Most Positive Power Supply Potential
Ground (0 V) Reference
Positive Supply Current
Source Terminal. May be an input or output.
Drain Terminal. May be an input or output.
Logic Control Input
Ohmic Resistance between D and S
ON Resistance Match between Any Two Channels, i.e., R
ON
max – R
ON
min
Flatness is defined as the difference between the maximum and minimum value of ON resistance as
measured over the specified analog signal range.
Source Leakage Current with the Switch OFF
Channel Leakage Current with the Switch ON
Analog Voltage on Terminals D, S
Maximum Input Voltage for Logic “0”
Minimum Input Voltage for Logic “1”
Input Current of the Digital Input
OFF Switch Source Capacitance
ON Switch Capacitance
Delay between applying the digital control input and the output switching ON.
Delay between applying the digital control input and the output switching OFF.
OFF time or ON time measured between the 90% points of both switches when switching
from one address state to another.
ON time measured between the 80% points of both switches when switching from one
address state to another.
A measure of the glitch impulse transferred from the digital input to the analog output during switching.
A measure of unwanted signal coupled through from one channel to another as a result of parasitic
capacitance.
A measure of unwanted signal coupling through an OFF switch.
Frequency at which the output is attenuated by –3 dB.
Frequency Response of the ON Switch
Loss due to the ON Resistance of the Switch
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although the ADG819/
ADG820 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. 0
–5–