WED3C7410E16M400BHI datasheet, PDF

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WED3C7410E16M400BHI: DescriptionIC,MICROPROCESSOR,32-BIT,CMOS,BGA,255PIN,CERAMIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size414KB，14 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WED3C7410E16M400BHI Overview

IC,MICROPROCESSOR,32-BIT,CMOS,BGA,255PIN,CERAMIC

WED3C7410E16M400BHI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Maker	Microsemi
Parts packaging code	BGA
Contacts	255
Reach Compliance Code	unknown
Address bus width	64
boundary scan	YES
maximum clock frequency	400 MHz
External data bus width	32
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	R-CBGA-B255
low power mode	YES
Number of terminals	255
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
speed	100 MHz
Maximum supply voltage	1.9 V
Minimum supply voltage	1.7 V
Nominal supply voltage	1.8 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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White Electronic Designs

WED3C7410E16M-400BHXX

RISC Microprocessor HiTCE Multichip Package

OVERVIEW

The WEDC 7410E/SSRAM multichip package is tar-

geted for high performance, space sensitive, low power

systems and supports the following power manage-

ment features: doze, nap, sleep and dynamic power

management.

The WED3C7410E16M-400BHXX multichip package

consists of:

7410E AltiVec RISC processor

Dedicated 2MB SSRAM L2 cache, configured as

256Kx72

21mmx25mm, 255 HiTCE Ball Grid Array (CBGA)

Maximum Core frequency = 400MHz @ 1.8V

Maximum L2 Cache frequency = 200MHz

Maximum 60x Bus frequency = 100MHz

*ADVANCED

The WED3C7410E16M-400BHXX is offered in Com-

mercial (0°C to +70°C), industrial (-40°C to +85°C) and

military (-55°C to +125°C) temperature ranges and is

well suited for embedded applications such as mis-

siles, aerospace, flight computers, fire control systems

and rugged critical systems.

*This data sheet describles a product that is developmental, is not

qualified or characterized; and is subject to change or cancellation

without notice.

FEATURES

Footprint compatible with WED3C7410E16M-XBX,

WED3C7558M-XBX and WED3C750A8M-200BX

Implementation of Altivecä technology instruction set

Optional, high-bandwidth MPX bus interface

HiTCE interposer for TCE compatibility to

laminate substrates for increased Board level

reliability

Available with eutectic or high lead solder balls

FIG. 1

MULTI-CHIP PACKAGE DIAGRAM

AltiVec is a trademark of Motorola Inc.

HiTCE is a trademark of Kyocera Corp.

White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com

September 2002 Rev. 0

WED3C7410E16M400BHI Related Products

	WED3C7410E16M400BHI	WED3C7410E16M400BHM	WED3C7410E16M400BHC	WED3C7410E16M400BHLC	WED3C7410E16M400BHLI
Description	IC,MICROPROCESSOR,32-BIT,CMOS,BGA,255PIN,CERAMIC	100MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	100MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 100MHz, CMOS, CBGA255, 21 X 25 MM, 3.60 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 100MHz, CMOS, CBGA255, 21 X 25 MM, 3.60 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Maker	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi
Parts packaging code	BGA	BGA	BGA	BGA	BGA
Contacts	255	255	255	255	255
Reach Compliance Code	unknown	unknown	unknown	compliant	compliant
Address bus width	64	64	64	64	64
boundary scan	YES	YES	YES	YES	YES
maximum clock frequency	400 MHz	400 MHz	400 MHz	400 MHz	400 MHz
External data bus width	32	32	32	32	32
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES	YES
JESD-30 code	R-CBGA-B255	R-CBGA-B255	R-CBGA-B255	R-CBGA-B255	R-CBGA-B255
low power mode	YES	YES	YES	YES	YES
Number of terminals	255	255	255	255	255
Maximum operating temperature	85 °C	125 °C	70 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-	-	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	225	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
Maximum supply voltage	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	MILITARY	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	20	20
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible
package instruction	-	21 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	BGA,	BGA,	BGA,

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