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DL5529A

Description
Zener Diode, 9.1V V(Z), 10%, 0.5W, Silicon, Unidirectional, HERMETIC SEALED, GLASS, MINIMELF-2
CategoryDiscrete semiconductor    diode   
File Size163KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Download Datasheet Parametric View All

DL5529A Overview

Zener Diode, 9.1V V(Z), 10%, 0.5W, Silicon, Unidirectional, HERMETIC SEALED, GLASS, MINIMELF-2

DL5529A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicro Commercial Components (MCC)
Parts packaging codeMELF
package instructionO-LELF-R2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresHIGH RELIABILITY, METALLURGICALLY BONDED
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeO-LELF-R2
JESD-609 codee0
Number of components1
Number of terminals2
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)240
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage9.1 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperature30
Maximum voltage tolerance10%
Working test current1 mA
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
DL5518B
THRU
DL5546B
500mW Silicon
Zener Diodes
Features
Zener Voltage 3.3V-33V
Low Reverse Leakage Characteristic
Metallurgically Bonded
High Reliability
Surface Mount Application
Mechanical Data
Case: Double slug type, hermetically sealed glass
Polarity: Cathode indicated by polarity band
MINIMELF
Cathode Mark
Maximum Ratings
Symbol
DC Power Dissipation
@T
EC=
125
O
C
Junction Temperature
Storage Temperature Range
Power Dissipation
aboveT
EC=
125
O
C
P
D
T
J
T
STG
P
D
Value
500
-65 to125
-65 to125
10
mW/
DIM
A
B
C
A
Units
mW
B
C
DIMENSION
INCHES
MIN
MAX
.134
.008
.055
.142
.016
.059
MM
MIN
MAX
3.40
0.20
1.40
3.60
0.40
1.50
NOTE
Electrical Characteristics @ 25 C Unless Otherwise Specified
Symbol
Max. Forward Voltage
@ I
F
=200mA
V
F
Maximum
1.1
Unit
V
SUGGESTED SOLDER
PAD LAYOUT
0.105
0.075”
0.030”
www.mccsemi.com
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2006/07/04
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