CLC400MDC datasheet, PDF - EEWORLD Datasheet

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CLC400MDC: DescriptionIC OP-AMP, 5000 uV OFFSET-MAX, UUC6, Operational Amplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size392KB，6 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com; Environmental Compliance

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CLC400MDC Overview

IC OP-AMP, 5000 uV OFFSET-MAX, UUC6, Operational Amplifier

CLC400MDC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	National Semiconductor（TI ）
Parts packaging code	WAFER
Contacts	6
Reach Compliance Code	compliant
ECCN code	EAR99
Amplifier type	OPERATIONAL AMPLIFIER
Maximum average bias current (IIB)	20 µA
Nominal Common Mode Rejection Ratio	50 dB
Maximum input offset voltage	5000 µV
JESD-30 code	X-XUUC-N6
Humidity sensitivity level	1
Negative supply voltage upper limit	-7 V
Nominal Negative Supply Voltage (Vsup)	-5 V
Number of functions	1
Number of terminals	6
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Nominal slew rate	1600 V/us
Supply voltage upper limit	7 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED

CLC400MDC Related Products

	CLC400MDC	CLC400AJ	CLC400AJE-TR13
Description	IC OP-AMP, 5000 uV OFFSET-MAX, UUC6, Operational Amplifier	IC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,CERAMIC	IC OP-AMP, 5000 uV OFFSET-MAX, PDSO8, PLASTIC, SOIC-8, Operational Amplifier
Is it Rohs certified?	conform to	incompatible	incompatible
Reach Compliance Code	compliant	unknown	unknown
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Maximum input offset voltage	5000 µV	9000 µV	5000 µV
JESD-30 code	X-XUUC-N6	R-XDIP-T8	R-PDSO-G8
Nominal Negative Supply Voltage (Vsup)	-5 V	-5 V	-5 V
Number of functions	1	1	1
Number of terminals	6	8	8
Package body material	UNSPECIFIED	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIE	DIP	SOP
Package shape	UNSPECIFIED	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	IN-LINE	SMALL OUTLINE
Certification status	Not Qualified	Not Qualified	Not Qualified
Supply voltage upper limit	7 V	7 V	7 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	NO	YES
Terminal form	NO LEAD	THROUGH-HOLE	GULL WING
Terminal location	UPPER	DUAL	DUAL
Maker	National Semiconductor（TI ）	-	National Semiconductor（TI ）
Parts packaging code	WAFER	-	SOIC
Contacts	6	-	8
ECCN code	EAR99	-	EAR99
Nominal Common Mode Rejection Ratio	50 dB	-	50 dB
Peak Reflow Temperature (Celsius)	260	-	NOT SPECIFIED
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED
package instruction	-	DIP, DIP8,.3	SOP, SOP8,.25
Architecture	-	CURRENT-FEEDBACK	CURRENT-FEEDBACK
Maximum bias current (IIB) at 25C	-	20 µA	20 µA
frequency compensation	-	YES	YES
JESD-609 code	-	e0	e0
low-dissonance	-	NO	NO
Maximum operating temperature	-	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C
Encapsulate equivalent code	-	DIP8,.3	SOP8,.25
method of packing	-	TUBE	TAPE AND REEL
power supply	-	+-5 V	+-5 V
minimum slew rate	-	430 V/us	430 V/us
Maximum slew rate	-	23 mA	23 mA
technology	-	BIPOLAR	BIPOLAR
Temperature level	-	INDUSTRIAL	INDUSTRIAL
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal pitch	-	2.54 mm	1.27 mm
broadband	-	YES	YES

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