CLC400AJ datasheet, PDF - EEWORLD Datasheet

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Datasheet> All Categories > Analog mixed-signal IC> Amplifier circuit> CLC400AJ

CLC400AJ: DescriptionIC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,CERAMIC; CategoryAnalog mixed-signal IC Amplifier circuit; File Size392KB，6 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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CLC400AJ Overview

IC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,CERAMIC

CLC400AJ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP8,.3
Reach Compliance Code	unknown
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	CURRENT-FEEDBACK
Maximum bias current (IIB) at 25C	20 µA
frequency compensation	YES
Maximum input offset voltage	9000 µV
JESD-30 code	R-XDIP-T8
JESD-609 code	e0
low-dissonance	NO
Nominal Negative Supply Voltage (Vsup)	-5 V
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
method of packing	TUBE
power supply	+-5 V
Certification status	Not Qualified
minimum slew rate	430 V/us
Maximum slew rate	23 mA
Supply voltage upper limit	7 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
broadband	YES
Base Number Matches	1

CLC400AJ Related Products

	CLC400AJ	CLC400MDC	CLC400AJE-TR13
Description	IC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,CERAMIC	IC OP-AMP, 5000 uV OFFSET-MAX, UUC6, Operational Amplifier	IC OP-AMP, 5000 uV OFFSET-MAX, PDSO8, PLASTIC, SOIC-8, Operational Amplifier
Is it Rohs certified?	incompatible	conform to	incompatible
Reach Compliance Code	unknown	compliant	unknown
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Maximum input offset voltage	9000 µV	5000 µV	5000 µV
JESD-30 code	R-XDIP-T8	X-XUUC-N6	R-PDSO-G8
Nominal Negative Supply Voltage (Vsup)	-5 V	-5 V	-5 V
Number of functions	1	1	1
Number of terminals	8	6	8
Package body material	CERAMIC	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	DIP	DIE	SOP
Package shape	RECTANGULAR	UNSPECIFIED	RECTANGULAR
Package form	IN-LINE	UNCASED CHIP	SMALL OUTLINE
Certification status	Not Qualified	Not Qualified	Not Qualified
Supply voltage upper limit	7 V	7 V	7 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	YES	YES
Terminal form	THROUGH-HOLE	NO LEAD	GULL WING
Terminal location	DUAL	UPPER	DUAL
package instruction	DIP, DIP8,.3	-	SOP, SOP8,.25
Architecture	CURRENT-FEEDBACK	-	CURRENT-FEEDBACK
Maximum bias current (IIB) at 25C	20 µA	-	20 µA
frequency compensation	YES	-	YES
JESD-609 code	e0	-	e0
low-dissonance	NO	-	NO
Maximum operating temperature	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-	-40 °C
Encapsulate equivalent code	DIP8,.3	-	SOP8,.25
method of packing	TUBE	-	TAPE AND REEL
power supply	+-5 V	-	+-5 V
minimum slew rate	430 V/us	-	430 V/us
Maximum slew rate	23 mA	-	23 mA
technology	BIPOLAR	-	BIPOLAR
Temperature level	INDUSTRIAL	-	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal pitch	2.54 mm	-	1.27 mm
broadband	YES	-	YES
Maker	-	National Semiconductor（TI ）	National Semiconductor（TI ）
Parts packaging code	-	WAFER	SOIC
Contacts	-	6	8
ECCN code	-	EAR99	EAR99
Nominal Common Mode Rejection Ratio	-	50 dB	50 dB
Peak Reflow Temperature (Celsius)	-	260	NOT SPECIFIED
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED

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