1.1 Objective of the Specifications ..................................................................................................................... 3
1.2 Definition of the Chip Module ..................................................................................................................... 3
1.3 Use of the Modules ...................................................................................................................................... 3
2.3 Temperature Range ..................................................................................................................................... 4
3 Drawing of the Chip Module HT2 MOA3 S20..................................................................... 7
3.1 Drawing of the Reel..................................................................................................................................... 7
5.2 Operation Modes and Configuration .......................................................................................................... 13
5.2.1 Modes of Operation............................................................................................................................ 13
5.2.2 Status Flow ........................................................................................................................................ 14
7 Characterisation and Test of the Final Transponder......................................................... 19
7.1 Characterisation of the Transponder .......................................................................................................... 19
7.2 Final Test of the Transponder .................................................................................................................... 19
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