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HT2MO2S2E3M-T

Description
rfid module and development tools hitag 1 moa2 module
CategoryModule/solution   
File Size161KB,22 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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rfid module and development tools hitag 1 moa2 module

HT2 MOA3 S20
HITAG 2 Chip Module
Preliminary Specification
Revision 1.1
August 1997
TM

HT2MO2S2E3M-T Related Products

HT2MO2S2E3M-T HT2MOA3S20/E/1 HT2MOA3S20/E/3 935260219122 935260062118
Description rfid module and development tools hitag 1 moa2 module IC SPECIALTY TELECOM CIRCUIT, XMA, 11.75 X 7.55 MM, 0.45 MM HEIGHT, MODULE, Telecom IC:Other IC SPECIALTY TELECOM CIRCUIT, XMA, 11.75 X 7.55 MM, 0.45 MM HEIGHT, MODULE, Telecom IC:Other IC SPECIALTY TELECOM CIRCUIT, XMA, 11.75 X 7.55 MM, 0.45 MM HEIGHT, MODULE, Telecom IC:Other IC SPECIALTY TELECOM CIRCUIT, XMA, 11.75 X 7.55 MM, 0.45 MM HEIGHT, MODULE, Telecom IC:Other
Maker - NXP NXP NXP NXP
Parts packaging code - MODULE MODULE MODULE MODULE
Reach Compliance Code - compliant compliant unknown unknown
JESD-30 code - R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X
Number of functions - 1 1 1 1
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Package body material - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage - 2.8 V 2.8 V 2.8 V 2.8 V
surface mount - NO NO NO NO
Telecom integrated circuit types - TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Terminal location - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
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