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GMM2649228CNTG-8

Description
Synchronous DRAM Module, 8MX64, 6ns, CMOS, PDMA144,
Categorystorage    storage   
File Size226KB,12 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

GMM2649228CNTG-8 Overview

Synchronous DRAM Module, 8MX64, 6ns, CMOS, PDMA144,

GMM2649228CNTG-8 Parametric

Parameter NameAttribute value
MakerSK Hynix
package instructionDIMM, DIMM144,32
Reach Compliance Codecompliant
Maximum access time6 ns
Maximum clock frequency (fCLK)125 MHz
I/O typeCOMMON
JESD-30 codeR-PDMA-N144
memory density536870912 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Number of terminals144
word count8388608 words
character code8000000
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX64
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIMM
Encapsulate equivalent codeDIMM144,32
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height31.75 mm
Maximum standby current0.0032 A
Maximum slew rate1.1 mA
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch0.8 mm
Terminal locationDUAL

GMM2649228CNTG-8 Related Products

GMM2649228CNTG-8 GMM2649228CNTG-10K GMM2649228CNTG-7J GMM2649228CNTG-7K
Description Synchronous DRAM Module, 8MX64, 6ns, CMOS, PDMA144, Synchronous DRAM Module, 8MX64, 8ns, CMOS, PDMA144, Synchronous DRAM Module, 8MX64, 6ns, CMOS, PDMA144, Synchronous DRAM Module, 8MX64, 6ns, CMOS, PDMA144,
Maker SK Hynix SK Hynix SK Hynix SK Hynix
package instruction DIMM, DIMM144,32 DIMM, DIMM144,32 DIMM, DIMM144,32 DIMM, DIMM144,32
Reach Compliance Code compliant compliant compliant compliant
Maximum access time 6 ns 8 ns 6 ns 6 ns
Maximum clock frequency (fCLK) 125 MHz 100 MHz 100 MHz 100 MHz
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PDMA-N144 R-PDMA-N144 R-PDMA-N144 R-PDMA-N144
memory density 536870912 bit 536870912 bit 536870912 bit 536870912 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 64 64 64 64
Number of terminals 144 144 144 144
word count 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 8000000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 8MX64 8MX64 8MX64 8MX64
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIMM DIMM DIMM DIMM
Encapsulate equivalent code DIMM144,32 DIMM144,32 DIMM144,32 DIMM144,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 4096 4096
Maximum seat height 31.75 mm 31.75 mm 31.75 mm 31.75 mm
Maximum standby current 0.0032 A 0.0032 A 0.0032 A 0.0032 A
Maximum slew rate 1.1 mA 0.9 mA 0.9 mA 0.9 mA
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location DUAL DUAL DUAL DUAL
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