DRAF143Z datasheet, PDF - EEWORLD Datasheet

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DRAF143Z: DescriptionSmall Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 1-Element, PNP, Silicon, ML3-N4-B, 3 PIN; CategoryDiscrete semiconductor The transistor; File Size418KB，3 Pages; ManufacturerPanasonic; Websitehttp://www.panasonic.co.jp/semicon/e-index.html; Environmental Compliance

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DRAF143Z Overview

Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 1-Element, PNP, Silicon, ML3-N4-B, 3 PIN

DRAF143Z Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Panasonic
package instruction	CHIP CARRIER, R-XBCC-N3
Contacts	3
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	BULIT-IN BIAS RESISTOR RATIO IS 10
Shell connection	COLLECTOR
Maximum collector current (IC)	0.1 A
Collector-emitter maximum voltage	50 V
Configuration	SINGLE WITH BUILT-IN RESISTOR
Minimum DC current gain (hFE)	80
JESD-30 code	R-XBCC-N3
Number of components	1
Number of terminals	3
Maximum operating temperature	150 °C
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Polarity/channel type	PNP
Maximum power dissipation(Abs)	0.1 W
Certification status	Not Qualified
surface mount	YES
Terminal form	NO LEAD
Terminal location	BOTTOM
transistor applications	SWITCHING
Transistor component materials	SILICON

DRAF143Z Preview

Tentative

DRAF143Z

Silicon PNP epitaxial planar type

For digital circuits

Marking Symbol : L8

Package Code : ML3-N4-B

Absolute Maximum Ratings　Ta = 25 °C

Parameter

Collector-base voltage (Emitter open)

Collector-emitter voltage (Base open)

Collector current

Total power dissipation

Junction temperature

Storage temperature

DRAF143Z

Total pages

page

Internal Connection

Rating

-50

-100

100

150

-55 to +150

Symbol

VCBO

VCEO

Tstg

Unit

°C

Resistance

value

Pin name

kΩ

4.7

kΩ

Base

Emitter

Collector

Electrical Characteristics　Ta = 25 °C±3 °C

Parameter

Symbol

Conditions

IC = -10

μA,

IE = 0

IC = -2 mA, IB = 0

VCB = -50 V, IE = 0

VCE = -50 V, IB = 0

VEB = -6 V, IC = 0

VCE = -10 V, IC = -5 mA

IC = -10 mA, IB = -0.5 mA

VCE = -0.2 V, IC = -5 mA

VCE = -5 V, IC = -100

μA

Min

-50

Typ

Max

-0.1

-0.5

-0.2

400

-0.25

Unit

μA

kΩ

Collector-base voltage (Emitter open)

VCBO

Collector-emitter voltage (Base open)

VCEO

Collector-base cutoff current (Emitter open)

ICBO

Collector-emitter cutoff current (Base open)

ICEO

Emitter-base cutoff current (Collector open)

IEBO

Forward current transfer ratio

hFE

Collector-emitter saturation voltage

VCE(sat)

Vi(on)

Input voltage

Vi(off)

Input resistance

Resistance ratio

R1/R2

-1.3

-0.4

-30% 4.7 +30%

0.08 0.10 0.12

Note: Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring

methods for transistors.

Packing

Embossed type (Thermo-compression sealing) : 10 000 pcs / reel

2010.2.25

2010.7.12

Prepared

Revised

Semiconductor Company, Panasonic Corporation

ML3-N4-B

Unit: mm

0.60

±0.05

0.39

−0.03

+0.01

0.25

±0.05

0.50

±0.05

0.65

±0.01

0.25

±0.05

0.05

±0.03

0.15

±0.05

0.35

±0.01

0.05

±0.03

1.00

±0.05

Request for your special attention and precautions in using the technical information and

semiconductors described in this book

(1)

If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and

regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples

of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any

other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any

other company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for general applications (such as office equipment, communications

equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.

Consult our sales staff in advance for information on the following applications:

–

Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,

life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of

the products may directly jeopardize life or harm the human body.

It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with

your using the products described in this book for any special application, unless our company agrees to your using the products in

this book for any special application.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-

provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,

thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

20100202

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