ADNS-7530
Integrated molded lead-frame DIP Sensor
Data Sheet
Theory of Operation
The ADNS-7530 integrated molded lead-frame DIP
sensor comprises of sensor and VCSEL in a single
package.
The advanced class of VCSEL was engineered by
PixArt
Imaging
to provide a laser diode with a single lon-
gitudinal and a single transverse mode. In contrast to
most oxide-based single-mode VCSEL, this class of
PixArt
VCSEL remains within single mode operation over a wide
range of output power. It has significantly lower power
consumption than a LED. It is an excellent choice for
optical navigation applications.
The sensor is based on Laser technology, which
measures changes in position by optically acquiring se-
quential surface images (frames) and mathematically
determining the direction and magnitude of movement.
It contains an Image Acquisition System (IAS), a Digital
Signal Processor (DSP), and a four wire serial port. The IAS
acquires microscopic surface images via the lens and il-
lumination system. These images are processed by the
DSP to determine the direction and distance of motion.
The DSP calculates the Δx and Δy relative displacement
values. An external microcontroller reads the Δx and Δy
information from the sensor serial port. The microcon-
troller then translates the data into PS2, USB, or RF signals
before sending them to the host PC or game console.
Features
•
Wide operating voltage: 2.7V-3.6V
•
Small form factor, integrated molded lead frame DIP
package
•
Low power architecture
•
Laser
Technology
•
Self-adjusting power-saving modes for longest battery
life
•
High speed motion detection up to 30 ips and 8g
•
Enhanced SmartSpeed self-adjusting frame rate for
optimum performance
•
Motion detect pin output
•
12-bits motion data registers.
•
Internal oscillator – no clock input needed.
•
Selectable 400, 800, 1200, 1600, 2000 cpi resolution.
•
Four wire serial port
•
Minimal number of passive components
•
Laser fault detect circuitry on-chip for Eye Safety
Compliance
•
Advanced Technology VCSEL chip
•
Single Mode Lasing operation
•
832-865 nm wavelength
Applications
•
Laser Mice
•
Optical trackballs
•
Integrated input devices
•
Battery-powered input devices
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
1
PixArt Imaging Inc.
E-mail:
fae_service@pixart.com.tw
PixArt Imaging Inc.
ADNS-7530 Integrated Molded Lead-Frame DIP Sensor
Pinout of ADNS-7530 Optical Mouse Sensor
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Name
VCSEL+VE
LASER_NEN
NCS
MISO
SCLK
MOSI
MOTION
XYLASER
VDD3
NC
GND
VDD3
RefA
DGND
VDDIO
VCSEL-VE
Description
Positive Terminal of VCSEL
LASER Enable (Active LOW)
Chip select (active low input)
Serial data output
(Master In/Slave Out)
Serial clock input
Serial data input
(Master Out/Slave In)
Motion Detect
(active low output)
XYLASER
3V Input
No Connection
Ground
3V Input
1.8V regulator output
Digital Ground
IO Voltage input (1.65~3.6V)
Negative Terminal of VCSEL
Lot Code
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
Product Number
Date Code
Vcsel Binning
Item
Product Number
Date Code
Marking
A7530
XYYWWZV
Remarks
X = Subcon Code
YYWW = Date Code
Z = Sensor Die Source
V = VCSEL Die Source
Numeric
VCSEL Binning
Lot Code
KL
VVV
Figure 1. Device pin-out for ADNS-7530
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail:
fae_service@pixart.com.tw
2
PixArt Imaging Inc.
ADNS-7530 Integrated Molded Lead-Frame DIP Sensor
Feature For
Illustration Only
9.10
0.358
4.10
0.161
Section A-A
Pin 1
10.90
(At shoulder)
0.429
16.20
0.638
9.10
0.358
0.50
0.020
2.41
0.095
3.96
0.156
0.36
0.014
1.69
0.067
2.83
0.111
4.05
0.159
16X 0.50
0.020
3.18
0.125
Protective
kapton tape
0.20
0.008
10.90
±
0.40 (At lead tip)
0.429
±
0.016
1.52
0.060
0.78
0.031
A
10.10
0.398
A
2X 0.50
0.020
0.89
0.035
1.78
0.070
Optical center
Sensor hole
5.05
0.199
2X 0.50
0.020
VCSEL hole
Notes:
1. Dimensions in milimeter / inches.
2. Dimensional tolerance:
±0.1mm.
3. Coplanarity of lead: 0.1mm
4. Lead pitch tolerance:
±0.15mm.
5. Non-cumulative pitch tolerance:
±0.15mm.
6. Maximum flash:
±0.2mm.
7. Angular tolerance: 3
8. Chamfer (25 x2) on the taper side of the lead.
9. Brackets () indicate reference dimension.
10. Document Number: LSR_INT_16A_Pkg_001
Figure 2. Package outline drawing
CAUTION:
It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail:
fae_service@pixart.com.tw
3
PixArt
Imaging Inc
ADNS-7530 Integrated Molded Lead-Frame DIP Sensor
USB Optical Mouse
Wireless
Regulatory Requirements
Laser Mouse Sensor
NCS
GND
Serial and Registers
VDD3
RefA
VDDIO
SCLK
MOSI
MISO
MOTION
DGND
Oscillator
Power and Control
•
Passes FCC B and worldwide analogous emission
limits when assembled into a mouse with shielded
cable and following
PixArt
recommendations.
•
Passes IEC-1000-4-3 radiated susceptibility level when
assembled into a mouse with shielded cable and
following
PixArt
recommendations.
•
Passes EN61000-4-4/IEC801-4 EFT tests when
assembled into a mouse with shielded cable and
following
PixArt
recommendations.
•
Provides sufficient ESD creepage/clearance distance
to avoid discharge up to 15kV when assembled into a
mouse according to usage instructions above.
Image Array
DSP
XYLASER
LASER Drive
LASER_NEN
VCSEL-VE
VCSEL
VCSEL+VE
Figure 3. Block diagram of ADNS-7530 integrated molded lead-frame DIP sensor
Overview of Laser Mouse Sensor Assembly
Guide post A
Sensor Hole
Sensor
Guide Post A
VCSEL Hole
Lens
B
B
PCB
Guide post B
PCB thickness
Base Plate Foot
Base Plate
Navigation Surface
DETAIL A
1.60
0.063
Top of PCB to Surface
Lens reference plane to Tracking surface (Z)
7.40
0.291
2.40
0.094
7.83
Die to Surface
0.308
DETAIL A
Gap between PCB and base plate
Top of sensor to surface
3.40
0.134
9.05
0.356
Figure 4. 2D Assembly drawing of ADNS-7530 sensor coupled with the ADNS-6150 lens, PCB and base plate (top and cross-sectional view)
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail:
fae_service@pixart.com.tw
PixArt Imaging Inc.
ADNS-7530 Integrated Molded Lead-Frame DIP Sensor
Assembly Recommendation
1. Insert the integrated molded lead-frame DIP
sensor and all other electrical components into the
application PCB.
2. This sensor package is only qualified for wave-solder
process.
3. Wave-solder the entire assembly in a no-wash solder
process utilizing a solder fixture. The solder fixture
is needed to protect the sensor during the solder
process. The fixture should be designed to expose
the sensor leads to solder while shielding the optical
aperture from direct solder contact.
4. Place the lens onto the base plate. Care must be taken
to avoid contamination on the optical surfaces.
5. Remove the protective kapton tapes from the optical
aperture of the sensor and VCSEL respectively. Care
must be taken to keep contaminants from entering
the aperture.
6. Insert the PCB assembly over the lens onto the base
plate. The sensor package should self-align to the lens.
The optical position reference for the PCB is set by the
base plate and lens. The alignment guide post of the
lens locks the lens and integrated molded lead-frame
DIP sensor together. Note that the PCB motion due to
button presses must be minimized to maintain optical
alignment.
7. Optional: The lens can be permanently locked to the
sensor package by melting the lens’ guide posts over
the sensor with heat staking process.
8. Tune the laser output power from the VCSEL to meet
the Eye Safe Class I Standard as detailed in the LASER
Power Adjustment Procedure.
9. Install the mouse top case. There must be a feature in
the top case (or other area) to press down onto the
sensor to ensure the sensor and lenses are interlocked
to the correct vertical height.
Design considerations for improving ESD Performance
For improved electrostatic discharge performance,
typical creepage and clearance distance are shown in
the table below. Assumption: base plate construction as
per the
PixArt
supplied IGES file and ADNS-6150, ADNS-
6160-001 or ADNS-6170-002 lens:
Lens
Creepage
Clearance
ADNS-6150
12.0 mm
2.1 mm
ADNS-6160-001
13.50 mm
1.28 mm
ADNS-6170-002
20.30 mm
1.28 mm
Note that the lens material is polycarbonate and
therefore, cyanoacrylate based adhesives or other
adhesives that may damage the lens should NOT be
used.
14.18
0.558
7X 1.78
0.070
3.18
0.125
Lens interference
(2.78)
0.110
Pin #1
2.31
0.091
1.05
0.041
0
∅
1.10
0.043
Pad ring
9.65
0.380
5.35
0.211
0
10.70
0.421
Optical center
0.89
0.035
13.35
0.526
16X
∅
0.70
0.028
Figure 5. Recommended PCB mechanical cutouts and spacing
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail:
fae_service@pixart.com.tw
5
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