UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Maker | e2v technologies |
| Parts packaging code | DIP |
| package instruction | 0.300 INCH, CERAMIC, DIP-24 |
| Contacts | 24 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| JESD-30 code | R-CDIP-T24 |
| memory density | 16384 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |