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DM74ALS37AJ/A+

Description
IC,LOGIC GATE,QUAD 2-INPUT NAND,ALS-TTL,DIP,14PIN,CERAMIC
Categorylogic    logic   
File Size138KB,2 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

DM74ALS37AJ/A+ Overview

IC,LOGIC GATE,QUAD 2-INPUT NAND,ALS-TTL,DIP,14PIN,CERAMIC

DM74ALS37AJ/A+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Schmitt triggerNO
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

DM74ALS37AJ/A+ Related Products

DM74ALS37AJ/A+ DM74ALS37AN/A+ DM74ALS37J/A+ DM74ALS37N/A+ DM54ALS37AJ DM74ALS37AM/A+
Description IC,LOGIC GATE,QUAD 2-INPUT NAND,ALS-TTL,DIP,14PIN,CERAMIC IC,LOGIC GATE,QUAD 2-INPUT NAND,ALS-TTL,DIP,14PIN,PLASTIC IC,LOGIC GATE,QUAD 2-INPUT NAND,ALS-TTL,DIP,14PIN,CERAMIC IC,LOGIC GATE,QUAD 2-INPUT NAND,ALS-TTL,DIP,14PIN,PLASTIC IC,LOGIC GATE,QUAD 2-INPUT NAND,ALS-TTL,DIP,14PIN,CERAMIC IC,LOGIC GATE,QUAD 2-INPUT NAND,ALS-TTL,SOP,14PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 SOP, SOP14,.25
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 R-PDIP-T14 R-XDIP-T14 R-PDIP-T14 R-XDIP-T14 R-PDSO-G14
JESD-609 code e0 e0 e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Number of terminals 14 14 14 14 14 14
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 125 °C 70 °C
Package body material CERAMIC PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP SOP
Encapsulate equivalent code DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 SOP14,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Schmitt trigger NO NO NO NO NO NO
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO YES
technology TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
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