REVISIONS
LTR
F
DESCRIPTION
Change to vendor similar part number for vendor CAGE 18324.
Changes to table I parameters t
EA
and C
OUT
. Add vendor CAGE
18324 to device types 03 and 04 as a source of supply. Add new
device design for device 04 for vendor CAGE 07933. Removed table
III, figure 5, and programming procedures. Editorial changes
throughout.
Changes in accordance with NOR 5962-R010-93
Changes in accordance with NOR 5962-R205-93
Updated boilerplate. Sheet 4, change V
OH
conditions from I
OH
= -2.0
mA to -1.6 mA; change C
IN
max. limit from 10 pF to 15 pF; change
C
OUT
max. limit for devices 01, 02, and 04 from 13 pF to
20 pF; add footnote 3 to t
DA
test column. Removed logic diagrams.
Remove vendors CAGE 50364 and 34335 as suppliers, and removed
their associated switching time test circuits.
Boilerplate update, part of 5 year review. ksr
Boilerplate update, part of 5 year review. ksr
Update drawing to meet current MIL-PRF-38535 requirements. – glg
DATE (YR-MO-DA)
91-10-30
APPROVED
M. A. Frye
G
H
J
93-02-12
93-08-10
97-05-29
M. A. Frye
M. A. Frye
Raymond Monnin
K
L
M
05-06-30
10-11-10
17-09-16
Raymond Monnin
Charles F. Saffle
Charles F. Saffle
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
M
1
M
2
M
3
M
4
M
5
M
6
M
7
M
8
M
9
M
10
M
11
M
12
M
13
Darrell Hill
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
C. R. Jackson
APPROVED BY
N. A. Hauck
DRAWING APPROVAL DATE
MICROCIRCUIT, MEMORY, DIGITAL,
SCHOTTKY BIPOLAR 32K PROGRAMMABLE
READ ONLY MEMORY (PROM), MONOLITHIC
SILICON
SIZE
CAGE CODE
82-09-01
REVISION LEVEL
M
A
SHEET
14933
1 OF
13
82008
5962-E570-17
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
82008
01
J
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
Generic number 1/
Circuit function
4096 words x 8 bits per word PROM, T.S.
4096 words x 8 bits per word PROM, T.S.
4096 words x 8 bits per word PROM, T.S.
4096 words x 8 bits per word PROM, T.S.
Access time
95 ns
55 ns
45 ns
70 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
J
K
L
X
3
Y
Descriptive designator
GDIP1-T24 or CDIP2-T24
GDFP2-F24 or CDFP3-F24
GDIP3-T24 or CDIP4-T24
CQCC1-N32
CQCC1-N28
CDFP4-F24
Terminals
24
24
24
32
28
24
Package style
dual-in-line package
flat package
dual-in-line package
rectangular leadless chip carrier
square leadless chip carrier
flat package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (V
CC
) ..............................................................................
Input voltage range ................................................................................
Storage temperature range ...................................................................
Lead temperature (soldering, 10 seconds) ............................................
Thermal resistance, junction-to-case (θ
JC
) ............................................
Output voltage applied...........................................................................
Output sink current ...............................................................................
Maximum power dissipation (P
D
) 3/ ......................................................
Maximum junction temperature (T
J
).......................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
)....................................................................
Minimum high level input voltage (V
IH
) ..................................................
Maximum low level input voltage (V
IL
) ...................................................
Normalized fanout (each output) ...........................................................
Case operating temperature range (T
C
) ................................................
1/
2/
3/
4.5 V dc to 5.5 V dc
2.0 V dc
0.8 V dc
12 mA
-55°C to +125°C
-0.3 to +7.0 V dc
+5.5 V dc
-65°C to +150°C
+300°C
See MIL-STD-1835
-0.3 V dc to V
CC
100 mA
1.04 W dc
+175°C
2/
Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin at the end of this document and
will also be listed in MIL-HDBK-103.
Heat sinking is recommended to reduce the junction temperature.
Must withstand the added P
D
due to short circuit test (e.g., I
OS
).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
82008
SHEET
M
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil/
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2.
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 2. When required in groups A or C (see 4.3), the devices shall be programmed by the
manufacturer prior to test in a checkerboard pattern (a minimum of 50 percent of the total number of bits programmed).
3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
82008
SHEET
M
3
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C
≤
T
C
≤
+125°C
V
CC
= 4.5 V to 5.5 V
unless otherwise specified
V
CC
= minimum,
I
OH
= -1.6 mA
V
CC
= minimum,
I
OL
= 16mA
I
IN
= -18 mA
V
CC
= V
CC
maximum
V
O
= 2.4 V
V
CC
= V
CC
maximum
V
O
= 0.4 V
V
IH
= V
CC
maximum
V
IL
= 0.4 V
V
CC
= V
CC
maximum
V
OUT
= 0.2 V
1/
Device
type
Group A
subgroups
Min
Limits
Max
Unit
High level output
voltage
Low level output
voltage
Input clamp voltage
High impedance
(Off-state) output
high current
High impedance
(Off-state) output
low current
High level input
current
Low level input
current
Short circuit output
current
Supply current
V
OH
All
1, 2, 3
2.4
V
V
OL
All
1, 2, 3
0.5
V
V
IC
I
OHZ
All
01
02,03,04
01
02,03,04
All
All
1, 2, 3
1, 2, 3
-1.5
100
40
V
µA
I
OLZ
1, 2, 3
-100
-40
µA
I
IH
I
IL
1, 2, 3
1, 2, 3
40
-250
μA
µA
I
OS
I
CC
All
All
1, 2, 3
1, 2, 3
-15
-100
190
mA
V
CC
= V
CC
maximum, all
inputs grounded
V
CC
= 5 V, f = 1 MHz,
V
IN
= 2.0 V, see 4.3.1c
V
CC
= 5 V, f = 1 MHz,
V
OUT
= 2.0 V, see 4.3.1c
V
CC
= 4.5 V and 5.5 V,
see figure 4
mA
pF
Input capacitance
C
IN
All
4
15
Output capacitance
C
OUT
01, 02, 04
03
01
02
03
04
01, 04
02, 03
4
20
12
95
55
45
70
45
35
45
35
pF
Address access
time
t
AA
ns
9, 10, 11
Chip enable access
time
Chip disable access
time 2/ 3/
t
EA
ns
t
DA
01
02, 03, 04
ns
1/ Not more than one output shall be grounded at one time, for a maximum of 1 second.
2/ C
L
≥
5 pF.
3/ May not be tested but is guaranteed to the limits specified in table I.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
82008
SHEET
M
4
Device Types
All
Case Outlines
Terminal
Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
J, K, Y, L
X
Terminal Symbol
3
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O
1
O
2
O
3
GND
O
4
O
5
O
6
O
7
O
8
CE
2
A
11
NC
NC
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
NC
O
1
O
2
O
3
NC
GND
O
4
NC
O
5
O
6
O
7
O
8
NC
CE
2
A
11
NC
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
NC
O
1
O
2
O
3
GND
NC
O
4
O
5
O
6
O
7
O
8
NC
CE
2
A
11
CE
1
A
10
A
9
A
8
V
CC
---
---
---
---
---
---
---
---
CE
1
NC
A
10
A
9
A
8
NC
V
CC
CE
1
A
10
A
9
A
8
V
CC
---
---
---
---
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
82008
SHEET
M
5
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