Low Cost, Dual, High Current Output
Line Driver with Shutdown
ADA4311-1
FEATURES
High speed
−3 dB bandwidth: 310 MHz, G = +5, R
LOAD
= 50 Ω
Slew rate: 1050 V/μs, R
LOAD
= 50 Ω
Wide output swing
20.6 V p-p differential, R
LOAD
of 100 Ω from 12 V supply
High output current
Low distortion
−98 dBc typical at 1 MHz, V
OUT
= 2 V p-p, G = +5, R
LOAD
= 100 Ω
−72 dBc typical at 10 MHz, V
OUT
= 2 V p-p, G = +5, R
LOAD
= 100 Ω
Power management and shutdown
Control inputs CMOS level compatible
Shutdown quiescent current: 1 mA/amplifier
Selectable quiescent current: 1 mA to 11.8 mA/amplifier
PIN CONFIGURATION
ADA4311-1
+V
S 1
NC
2
OUT A
3
–IN A
4
+IN A
5
10
OUT B
9
8
7
6
–IN B
+IN B
PD1
06940-001
PD0
NC = NO CONNECT
Figure 1. Thermally Enhanced, 10-Lead MINI_SO_EP
TYPICAL APPLICATION
1/2
ADA4311-1
V
MID
*
APPLICATIONS
Home networking line drivers
Twisted pair line drivers
Power line communications (PLC)
Video line drivers
ARB line drivers
I/Q channel amplifiers
V
CC
–
GND
1/2
06940-002
ADA4311-1
*V
MID =
2
Figure 2. Typical PLC Driver Application
GENERAL DESCRIPTION
The ADA4311-1 is comprised of two high speed, current
feedback operational amplifiers. The high output current, high
bandwidth, and fast slew rate make it an excellent choice for
broadband applications requiring high linearity performance
while driving low impedance loads.
The ADA4311-1 incorporates a power management function
that provides shutdown capabilities and the ability to optimize
the quiescent current of the amplifiers. The CMOS-compatible,
power-down control pins (PD1 and PD0) enable the ADA4311-1
to operate in four different modes: full power, medium power,
low power, and complete power-down. In power-down mode, the
quiescent current drops to only 1.0 mA/amplifier, while the outputs
go to a high impedance state.
The ADA4311-1 is available in a thermally enhanced, 10-lead
MSOP with an exposed paddle for improved thermal conduction.
The ADA4311-1 is rated to work in the extended industrial
temperature range of −40°C to +85°C.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2007 Analog Devices, Inc. All rights reserved.
ADA4311-1
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Pin Configuration............................................................................. 1
Typical Application........................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Typical Performance Characteristics ............................................. 7
Theory of Operation ...................................................................... 10
Application Information................................................................ 11
Feedback Resistor Selection...................................................... 11
Power Control Modes of Operation ........................................ 11
Exposed Thermal Pad Connections ........................................ 11
Powerline Application ............................................................... 11
Board Layout............................................................................... 12
Power Supply Bypassing ............................................................ 12
Outline Dimensions ....................................................................... 13
Ordering Guide .......................................................................... 13
REVISION HISTORY
8/07—Revision 0: Initial Version
Rev. 0 | Page 2 of 16
ADA4311-1
SPECIFICATIONS
V
S
= 12 V, R
F
= 499 Ω (@ T
A
= 25°C, G = +5, R
L
= 100 Ω to V
S
/2), unless otherwise noted.
Table 1.
Parameter
DYNAMIC PERFORMANCE
−3 dB Bandwidth
Test Conditions/Comments
V
OUT
= 0.1 V p-p, PD1 = 0, PD0 = 0, R
LOAD
= 50 Ω
V
OUT
= 0.1 V p-p, PD1 = 0, PD0 = 1, R
LOAD
= 50 Ω
V
OUT
= 0.1 V p-p, PD1 = 1, PD0 = 0, R
LOAD
= 50 Ω
V
OUT
= 10.2 V p-p, PD1 = 0, PD0 = 0, R
LOAD
= 50 Ω
V
OUT
= 2 V p-p, PD1 = 0, PD0 = 0
V
OUT
= 2 V p-p, PD1 = 0, PD0 = 1
V
OUT
= 2 V p-p, PD1 = 1, PD0 = 0
f
C
= 1 MHz, V
OUT
= 2 V p-p
PD1 = 0, PD0 = 0
PD1 = 0, PD0 = 1
PD1 = 1, PD0 = 0
f
C
= 10 MHz, V
OUT
= 2 V p-p
PD1 = 0, PD0 = 0
PD1 = 0, PD0 = 1
PD1 = 1, PD0 = 0
f
C
= 20 MHz, V
OUT
= 2 V p-p
PD1 = 0, PD0 = 0
PD1 = 0, PD0 = 1
PD1 = 1, PD0 = 0
f = 100 kHz
f = 100 kHz
−3
−9
−4
4
15
57
−98
−95
−86
−72
−63
−52
−56
−49
−43
2.4
17
+1
−2
+4.5
14
35
62
500
11
11
20.2
11.1
0.9
11.1
0.8
20.6
12
11.8
7.9
5.2
0.9
+3
+3
+16
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
nV/√Hz
pA/√Hz
mV
μA
μA
MΩ
MΩ
dB
kΩ
V
P
V
P
V
P
V
P
V p-p
V
mA/amp
mA/amp
mA/amp
mA/amp
Min
Typ
310
220
140
12.9
1050
1050
1000
Max
Unit
MHz
MHz
MHz
MHz
V/μs
V/μs
V/μs
Full Power Bandwidth
Slew Rate
NOISE/DISTORTION PERFORMANCE
Differential Distortion (Worst
Harmonic)
Input Voltage Noise
Input Current Noise
DC PERFORMANCE
Input Offset Voltage
Input Bias Current
Noninverting Input
Inverting Input
Open-Loop Transimpedance
Common-Mode Rejection
INPUT CHARACTERISTICS
Input Resistance
OUTPUT CHARACTERISTICS
Single-Ended, +Swing
Single-Ended, −Swing
Single-Ended, +Swing
Single-Ended, −Swing
Differential Swing
POWER SUPPLY
Single Supply
Supply Current
R
LOAD
= 50 Ω
R
LOAD
= 100 Ω
+IN, f < 100 kHz
R
LOAD
= 50 Ω
R
LOAD
= 50 Ω
R
LOAD
= 100 Ω
R
LOAD
= 100 Ω
R
LOAD
= 100 Ω
1
0.9
PD1 = 0, PD0 = 0
PD1 = 0, PD0 = 1
PD1 = 1, PD0 = 0
PD1 = 1, PD0 = 1
10.5
7
4.3
13
9
6.3
1.3
Rev. 0 | Page 3 of 16
ADA4311-1
Parameter
POWER-DOWN PINS
PD1, PD0 Threshold
High Level Input Voltage, V
IH
Low Level Input Voltage, V
IL
PD1, PD0 = 0 Pin Bias Current
PD1, PD0 = 1 Pin Bias Current
Enable/Disable Time
Power Supply Rejection Ratio
Test Conditions/Comments
Referenced to GND
2
0
−1.5
40
−63
Min
Typ
1.5
5
0.8
+1.5
80
Max
Unit
V
V
V
μA
μA
ns
dB
PD1 or PD0 = 0 V
PD1 or PD0 = 3 V
−0.2
63
130/116
−70
Rev. 0 | Page 4 of 16
ADA4311-1
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
Rating
13.6 V
(T
JMAX
− T
A
)/θ
JA
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4311-1 is
limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a junction temperature of
150°C for an extended period can result in changes in silicon
devices, potentially causing degradation or loss of functionality.
Figure 3 shows the maximum safe power dissipation in
the package vs. the ambient temperature for the 10-lead
MINI_SO_EP (44°C/W) on a JEDEC standard 4-layer board.
θ
JA
values are approximations.
5.0
4.5
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating
only; functional operation of the device at these or any other
conditions above those indicated in the operational section of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
THERMAL RESISTANCE
Thermal resistance (θ
JA
) is specified for the worst-case conditions,
that is, θ
JA
is specified for device soldered in circuit board for
surface-mount packages.
Table 3.
Package Type
10-Lead MINI_SO_EP
θ
JA
44
Unit
°C/W
MAXIMUM POWER DISSIPATION (W)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
–35
–15
5
25
45
65
85
06940-003
MINI_SO_EP-10
0
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
Rev. 0 | Page 5 of 16
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