HCPL-0720/7720/0721/7721
40 ns Propagation Delay, CMOS Optocoupler
Data Sheet
Description
Available in either an 8-pin DIP or SO-8 package style
respectively, the HCPL-772X or HCPL-072X
optocouplers utilize the latest CMOS IC technology to
achieve outstanding performance with very low power
consumption. The HCPL-772X/072X require only two
bypass capacitors for complete CMOS compatability.
Basic building blocks of the HCPL-772X/072X are a
CMOS LED driver IC, a high speed LED and a CMOS
detector IC. A CMOS logic input signal controls the LED
driver IC which supplies current to the LED. The
detector IC incorporates an integrated photodiode, a
high-speed transimpedance amplifier, and a voltage
comparator with an output driver.
Features
• +5 V CMOS compatibility
• 20 ns maximum prop. delay skew
• High speed: 25 MBd
• 40 ns max. prop. delay
• 10 kV/µs minimum common mode rejection
• –40 to 85°C temperature range
• Safety and regulatory approvals
UL recognized
– 3750 Vrms for 1 min. per UL 1577
– 5000 Vrms for 1 min. per UL 1577 (for option 020)
CSA component acceptance notice #5
IEC/EN/DIN EN 60747-5-2
– V
IORM
= 630 Vpeak for HCPL-772X option 060
– V
IORM
= 560 Vpeak for HCPL-072X option 060
Applications
• Digital fieldbus isolation: CC-Link, DeviceNet, Profibus, SDS
• AC plasma display panel level shifting
• Multiplexed data transmission
• Computer peripheral interface
• Microprocessor system interface
Functional Diagram
**V
DD1
1
8
V
DD2
**
V
I
2
I
O
7
NC*
*
3
LED1
6
V
O
GND
1
4
SHIELD
5
GND
2
* Pin 3 is the anode of the internal LED and must be left
unconnected for guaranteed data sheet performance.
Pin 7 is not connected internally.
**A 0.1
µF
bypass capacitor must be connected between
pins 1 and 4, and 5 and 8.
TRUTH TABLE
(POSITIVE LOGIC)
V
I
, INPUT
H
L
LED1
OFF
ON
V
O
, OUTPUT
H
L
CAUTION:
It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Selection Guide
8-Pin DIP
(300 Mil)
HCPL-7721
HCPL-7720
Small Outline
SO-8
HCPL-0721
HCPL-0720
Data Rate
25 MB
25 MB
PWD
6 ns
8 ns
Ordering Information
Specify Part Number followed by Option Number (if desired)
Example
HCPL-7720#XXXX
020 = 5000 Vrms/1 minute UL Rating Option*
060 = IEC/EN/DIN EN 60747-5-2 Option
300 = Gull Wing Surface Mount Option (HCPL-7720 only)
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
No Option and Option 300 contain 50 units (HCPL-772X), 100 units (HCPL-072X) per tube.
Option 500 contain 1000 units (HCPL-772X), 1500 units (HCPL-072X) per reel.
Option data sheets available. Contact Avago sales representative or authorized distributor.
*Combination of Optiion 020 and Option 060 is not available.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use “–”
Package Outline Drawing
HCPL-772X 8-Pin DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
OPTION CODE*
6.35 ± 0.25
(0.250 ± 0.010)
DATE CODE
7.62 ± 0.25
(0.300 ± 0.010)
A XXXXV
YYWW
1
1.19 (0.047) MAX.
2
3
4
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS:
– OPTION 300 AND 500 NOT MARKED
– "L" = OPTION 020
– "V" = OPTION 060
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
2
Package Outline Drawing
HCPL-772X Package with Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Package Outline Drawing
HCPL-072X Outline Drawing (Small Outline SO-8 Package)
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXXV
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
*
5.080 ± 0.127
(0.200 ± 0.005)
7°
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
3
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
t
p
T
p
T
L
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
TEMPERATURE
T
smax
T
smin
RAMP-DOWN
6 °C/SEC. MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
t
L
60 to 150 SEC.
NOTES:
1. THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
2. USE OF NON-CHLORINE-ACTIVATED FLUXES IS HIGHLY RECOMMENDED.
Regulatory Information
The HCPL-772X/072X have been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
4
Insulation and Safety Related Specifications
Parameter
Minimum External Air
Gap (Clearance)
Minimum External
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
Symbol
L(I01)
L(I02)
Value
772X
072X
7.1
4.9
7.4
0.08
4.8
0.08
Units
mm
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
CTI
≥175
≥175
Volts
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89,
Table 1)
All Avago data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when
determining the circuit insulation
requirements. However, once
mounted on a printed circuit
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For
creepage, the shortest distance
path along the surface of a
printed circuit board between the
solder fillets of the input and
output leads must be considered.
There are recommended
techniques such as grooves and
ribs which may be used on a
printed circuit board to achieve
desired creepage and clearances.
Creepage and clearance distances
will also change depending on
factors such as pollution degree
and insulation level.
5
京公网安备 11010802033920号
EEWORLD
