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EDI8L32256C20AI

Description
SRAM Module, 256KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68
Categorystorage    storage   
File Size662KB,8 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
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EDI8L32256C20AI Overview

SRAM Module, 256KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68

EDI8L32256C20AI Parametric

Parameter NameAttribute value
MakerWhite Electronic Designs Corporation
package instructionPLASTIC, MO-47AE, LCC-68
Reach Compliance Codeunknown
Maximum access time20 ns
Spare memory width16
JESD-30 codeS-PQCC-J68
length24.2316 mm
memory density8388608 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX32
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width24.2316 mm
EDI8L32256C
Features
256Kx32 bit CMOS Static
DSP Memory Solution
• Texas Instruments TMS320C3x, TMS320C4x
• Analog SHARC
TM
DSP
• Motorola DSP96002
Random Access Memory Array
• Fast Access Times: 15, 17, 20 and 25ns
• Individual Byte Enables
• User Configurable Organization
with Minimal Additional Logic
• Master Output Enable and Write Control
• TTL Compatible Inputs and Outputs
• Fully Static, No Clocks
Surface Mount Package
• 68 Lead PLCC, No. 99, JEDEC MO-47AE
• Small Footprint, 0.990 Sq. In.
• Multiple Ground Pins for Maximum
Noise Immunity
Single +5V (±5%) Supply Operation
256Kx32, 5V Static Ram
The EDI8L32256C is a high speed, 5V, 8 megabit SRAM.
The device is available with access times of 15, 17, 20 and
25ns, allowing the creation of a no wait state DSP memory
solution.
The device can be configured as a 256Kx32 and used to
create a single chip external data memory solution for
Texas Instruments' TMS320C30/31 (figure 3), TMS
320C32 (figure 4) or TMS320C4x (figure 5), Motorola's
DSP96002 and Analog Device's SHARC
TM
DSP (figure 6).
Alternatively the device's chip enables can be used to
configure it as a 512Kx16. A 512Kx48 program memory
array for Analog's SHARC
TM
DSP is created using three
devices (figure 7). If this memory is too deep, two 256Kx24s
(EDI8L24256C) can be used to create a 256Kx48 array or
two 128Kx24s (EDI8L24128C) can be used to create a
128Kx48 array.
The device provides a 32% space savings when com-
pared to two monolithic 256Kx16, 44 pin SOJs.
The device provides a memory upgrade of the
EDI8L32128C (128Kx32) and the EDI8L3265C (64Kx32).
For more memory the device can be upgraded to the
EDI8L32512C (512Kx32). For additional upgrade infor-
mation see figure 8.
NOTE: Solder Reflow temperature should not exceed 230°C for 10 seconds.
Pin Configurations and Block Diagram
Note: For memory upgrade information refer to page 8,
Figure 8 "EDI MCM-L upgrade path".
February 1999 Rev. 5
ECO# 11254
T
NO
D
DE
EN
M
M
CO
RE
1
Pin Names
AØ-A17
EØ-E1
BSØ-BS3
W
G
DQØ-DQ31
VCC
VSS
NC
R
FO
Address Inputs
Chip Enables (One per Word)
Byte Selects (One per Byte)
Master Write Enable
Master Output Enable
Common Data Input/Output
Power (+5V±5%)
Ground
No Connection
White Electronic Designs Corporation • (508) 366-5151 • www.whiteedc.com
W
NE
GN
SI
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EDI8L32256C20AI Related Products

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Description SRAM Module, 256KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 256KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 256KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 256KX32, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 256KX32, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 256KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 SRAM Module, 256KX32, 25ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68
package instruction PLASTIC, MO-47AE, LCC-68 PLASTIC, MO-47AE, LCC-68 PLASTIC, MO-47AE, LCC-68 PLASTIC, MO-47AE, LCC-68 PLASTIC, MO-47AE, LCC-68 PLASTIC, MO-47AE, LCC-68 PLASTIC, MO-47AE, LCC-68
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
Maximum access time 20 ns 25 ns 15 ns 17 ns 17 ns 20 ns 25 ns
Spare memory width 16 16 16 16 16 16 16
JESD-30 code S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68
length 24.2316 mm 24.2316 mm 24.2316 mm 24.2316 mm 24.2316 mm 24.2316 mm 24.2316 mm
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1
Number of terminals 68 68 68 68 68 68 68
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C 70 °C
organize 256KX32 256KX32 256KX32 256KX32 256KX32 256KX32 256KX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QCCJ QCCJ QCCJ QCCJ QCCJ QCCJ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.57 mm 4.57 mm 4.57 mm 4.57 mm 4.57 mm 4.57 mm 4.57 mm
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal form J BEND J BEND J BEND J BEND J BEND J BEND J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 24.2316 mm 24.2316 mm 24.2316 mm 24.2316 mm 24.2316 mm 24.2316 mm 24.2316 mm
Maker White Electronic Designs Corporation - White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation
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