DP8428V-70/B+ datasheet, PDF - EEWORLD Datasheet

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DP8428V-70/B+: DescriptionIC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，23 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DP8428V-70/B+ Overview

IC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN

DP8428V-70/B+ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	QCCJ, LDCC68,1.0SQ
Reach Compliance Code	unknown
JESD-30 code	S-PQCC-J68
JESD-609 code	e0
Number of terminals	68
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	240 mA
Nominal supply voltage	5 V
surface mount	YES
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD

DP8428V-70/B+ Related Products

	DP8428V-70/B+	NS32828V-70/B+	NS32828D-70/A+	DP8428V-70/A+	DP8428V-80/A+
Description	IC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN	IC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN	IC,MEMORY CONTROLLER,ALS-TTL,DIP,52PIN	IC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN	IC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC68,1.0SQ	DIP, DIP52,.6	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC68,1.0SQ
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-PQCC-J68	S-PQCC-J68	R-XDIP-T52	S-PQCC-J68	S-PQCC-J68
JESD-609 code	e0	e0	e0	e0	e0
Number of terminals	68	68	52	68	68
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	DIP	QCCJ	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ	LDCC68,1.0SQ	DIP52,.6	LDCC68,1.0SQ	LDCC68,1.0SQ
Package shape	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER
power supply	5 V	5 V	5 V	5 V	5 V
Maximum slew rate	240 mA	240 mA	240 mA	240 mA	240 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	YES
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	THROUGH-HOLE	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	DUAL	QUAD	QUAD

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