IC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| package instruction | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-PQCC-J68 |
| JESD-609 code | e0 |
| Number of terminals | 68 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Maximum slew rate | 240 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| DP8428V-70/A+ | NS32828V-70/B+ | NS32828D-70/A+ | DP8428V-70/B+ | DP8428V-80/A+ | |
|---|---|---|---|---|---|
| Description | IC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN | IC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN | IC,MEMORY CONTROLLER,ALS-TTL,DIP,52PIN | IC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN | IC,MEMORY CONTROLLER,ALS-TTL,LDCC,68PIN |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
| package instruction | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | DIP, DIP52,.6 | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-PQCC-J68 | S-PQCC-J68 | R-XDIP-T52 | S-PQCC-J68 | S-PQCC-J68 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 68 | 68 | 52 | 68 | 68 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ | DIP | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ | LDCC68,1.0SQ | DIP52,.6 | LDCC68,1.0SQ | LDCC68,1.0SQ |
| Package shape | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum slew rate | 240 mA | 240 mA | 240 mA | 240 mA | 240 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | DUAL | QUAD | QUAD |