ADC12D1000RFIUT datasheet, PDF

Datasheet> All Categories > Analog mixed-signal IC> converter> ADC12D1000RFIUT

ADC12D1000RFIUT: DescriptionIC 2-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA292, LEAD FREE, PLASTIC, MS-034BAL-2, BGA-292, Analog to Digital Converter; CategoryAnalog mixed-signal IC converter; File Size3MB，67 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

Stay tuned Parametric Compare

ADC12D1000RFIUT Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	ADC12D1000RFIUT	-	-	View	Buy Now

ADC12D1000RFIUT Overview

IC 2-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA292, LEAD FREE, PLASTIC, MS-034BAL-2, BGA-292, Analog to Digital Converter

ADC12D1000RFIUT Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	HBGA, BGA292,20X20,50
Reach Compliance Code	unknown
ECCN code	3A001.A.5.A.3
Maximum analog input voltage	0.86 V
Minimum analog input voltage	-0.86 V
Converter type	ADC, PROPRIETARY METHOD
JESD-30 code	S-PBGA-B292
length	27 mm
Maximum linear error (EL)	0.177%
Humidity sensitivity level	1
Number of analog input channels	2
Number of digits	12
Number of functions	1
Number of terminals	292
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output bit code	BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY
Output format	PARALLEL, WORD
Package body material	PLASTIC/EPOXY
encapsulated code	HBGA
Encapsulate equivalent code	BGA292,20X20,50
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	225
power supply	1.9 V
Certification status	Not Qualified
Sampling rate	1000 MHz
Sample and hold/Track and hold	TRACK
Maximum seat height	2.58 mm
Nominal supply voltage	1.9 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm

ADC12D1000RFIUT Related Products

	ADC12D1000RFIUT	ADC12D1000RFIUT/NOPB	ADC12D1600RFIUT/NOPB	ADC12D1600RFIUT
Description	IC 2-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA292, LEAD FREE, PLASTIC, MS-034BAL-2, BGA-292, Analog to Digital Converter	IC 2-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA292, LEAD FREE, PLASTIC, MS-034BAL-2, BGA-292, Analog to Digital Converter	IC 2-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA292, LEAD FREE, PLASTIC, MS-034BAL-2, BGA-292, Analog to Digital Converter	IC 2-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA292, LEAD FREE, PLASTIC, MS-034BAL-2, BGA-292, Analog to Digital Converter
Is it Rohs certified?	incompatible	conform to	conform to	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	HBGA, BGA292,20X20,50	LEAD FREE, PLASTIC, MS-034BAL-2, BGA-292	LEAD FREE, PLASTIC, MS-034BAL-2, BGA-292	HBGA, BGA292,20X20,50
Reach Compliance Code	unknown	compliant	compliant	unknow
ECCN code	3A001.A.5.A.3	3A001.A.5.A.3	3A001.A.5.A.3	3A001.A.5.A.3
Maximum analog input voltage	0.86 V	0.86 V	0.86 V	0.86 V
Minimum analog input voltage	-0.86 V	-0.86 V	-0.86 V	-0.86 V
Converter type	ADC, PROPRIETARY METHOD	ADC, PROPRIETARY METHOD	ADC, PROPRIETARY METHOD	ADC, PROPRIETARY METHOD
JESD-30 code	S-PBGA-B292	S-PBGA-B292	S-PBGA-B292	S-PBGA-B292
length	27 mm	27 mm	27 mm	27 mm
Maximum linear error (EL)	0.177%	0.177%	0.177%	0.177%
Number of analog input channels	2	2	2	2
Number of digits	12	12	12	12
Number of functions	1	1	1	1
Number of terminals	292	292	292	292
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Output bit code	BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY	BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY	BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY	BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY
Output format	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HBGA	HBGA	HBGA	HBGA
Encapsulate equivalent code	BGA292,20X20,50	BGA292,20X20,50	BGA292,20X20,50	BGA292,20X20,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG
power supply	1.9 V	1.9 V	1.9 V	1.9 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Sampling rate	1000 MHz	1000 MHz	1600 MHz	1600 MHz
Sample and hold/Track and hold	TRACK	TRACK	TRACK	TRACK
Maximum seat height	2.58 mm	2.58 mm	2.58 mm	2.58 mm
Nominal supply voltage	1.9 V	1.9 V	1.9 V	1.9 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	27 mm	27 mm	27 mm	27 mm

Recommended Resources

PCB board interconnection method

Tire flat alarm circuit

Encoded infrared transmitter circuit

Bomb Drop Game Circuit

W723 extended output current voltage stabilizing circuit

Infrared detector circuit

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components