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TC55465AP-35

Description
IC 64K X 4 CACHE SRAM, 35 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM
Categorystorage    storage   
File Size354KB,7 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TC55465AP-35 Overview

IC 64K X 4 CACHE SRAM, 35 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM

TC55465AP-35 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeDIP
package instructionDIP, DIP28,.3
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time35 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T28
JESD-609 codee0
length34.9 mm
memory density262144 bit
Memory IC TypeCACHE SRAM
memory width4
Number of functions1
Number of terminals28
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height4.45 mm
Maximum standby current0.001 A
Minimum standby current4.5 V
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

TC55465AP-35 Related Products

TC55465AP-35 TC55465AJ-15 TC55465AJ-35 TC55465AJ-20 TC55465AP-25 TC55465AJ-25 TC55465AP-20
Description IC 64K X 4 CACHE SRAM, 35 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM IC 64K X 4 CACHE SRAM, 15 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM IC 64K X 4 CACHE SRAM, 35 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM IC 64K X 4 CACHE SRAM, 20 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM IC 64K X 4 CACHE SRAM, 25 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM IC 64K X 4 CACHE SRAM, 25 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM IC 64K X 4 CACHE SRAM, 20 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor
Parts packaging code DIP SOJ SOJ SOJ DIP SOJ DIP
Contacts 28 28 28 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknow
Maximum access time 35 ns 15 ns 35 ns 20 ns 25 ns 25 ns 20 ns
JESD-30 code R-PDIP-T28 R-PDSO-J28 R-PDSO-J28 R-PDSO-J28 R-PDIP-T28 R-PDSO-J28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 34.9 mm 18.42 mm 18.42 mm 18.42 mm 34.9 mm 18.42 mm 34.9 mm
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bi
Memory IC Type CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
memory width 4 4 4 4 4 4 4
Number of functions 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 64KX4 64KX4 64KX4 64KX4 64KX4 64KX4 64KX4
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOJ SOJ SOJ DIP SOJ DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 240 240 240 240 240
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.45 mm 3.7 mm 3.7 mm 3.7 mm 4.45 mm 3.7 mm 4.45 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES YES NO YES NO
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND J BEND J BEND THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 7.7 mm 7.7 mm 7.7 mm 7.62 mm 7.7 mm 7.62 mm
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead - Contains lead
package instruction DIP, DIP28,.3 SOJ, SOJ28,.34 SOJ, SOJ28,.34 SOJ, SOJ28,.34 DIP, DIP28,.3 - DIP, DIP28,.3
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 - EAR99
I/O type COMMON COMMON COMMON COMMON COMMON - COMMON
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE - 3-STATE
Encapsulate equivalent code DIP28,.3 SOJ28,.34 SOJ28,.34 SOJ28,.34 DIP28,.3 - DIP28,.3
power supply 5 V 5 V 5 V 5 V 5 V - 5 V
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A - 0.001 A
Minimum standby current 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V - 4.5 V
Maximum slew rate 0.1 mA 0.12 mA 0.1 mA 0.12 mA 0.12 mA - 0.12 mA
technology CMOS CMOS CMOS CMOS CMOS - CMOS
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