IC 64K X 4 CACHE SRAM, 35 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | DIP |
| package instruction | DIP, DIP28,.3 |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 35 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| length | 34.9 mm |
| memory density | 262144 bit |
| Memory IC Type | CACHE SRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX4 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.45 mm |
| Maximum standby current | 0.001 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.1 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |





| TC55465AP-35 | TC55465AJ-15 | TC55465AJ-35 | TC55465AJ-20 | TC55465AP-25 | TC55465AJ-25 | TC55465AP-20 | |
|---|---|---|---|---|---|---|---|
| Description | IC 64K X 4 CACHE SRAM, 35 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM | IC 64K X 4 CACHE SRAM, 15 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM | IC 64K X 4 CACHE SRAM, 35 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM | IC 64K X 4 CACHE SRAM, 20 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM | IC 64K X 4 CACHE SRAM, 25 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM | IC 64K X 4 CACHE SRAM, 25 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM | IC 64K X 4 CACHE SRAM, 20 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | DIP | SOJ | SOJ | SOJ | DIP | SOJ | DIP |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| Maximum access time | 35 ns | 15 ns | 35 ns | 20 ns | 25 ns | 25 ns | 20 ns |
| JESD-30 code | R-PDIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDIP-T28 | R-PDSO-J28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 34.9 mm | 18.42 mm | 18.42 mm | 18.42 mm | 34.9 mm | 18.42 mm | 34.9 mm |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
| Memory IC Type | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOJ | SOJ | SOJ | DIP | SOJ | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.45 mm | 3.7 mm | 3.7 mm | 3.7 mm | 4.45 mm | 3.7 mm | 4.45 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | NO | YES | NO |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.7 mm | 7.7 mm | 7.7 mm | 7.62 mm | 7.7 mm | 7.62 mm |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | - | Contains lead |
| package instruction | DIP, DIP28,.3 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | DIP, DIP28,.3 | - | DIP, DIP28,.3 |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | - | COMMON |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| Encapsulate equivalent code | DIP28,.3 | SOJ28,.34 | SOJ28,.34 | SOJ28,.34 | DIP28,.3 | - | DIP28,.3 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| Maximum standby current | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | - | 0.001 A |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
| Maximum slew rate | 0.1 mA | 0.12 mA | 0.1 mA | 0.12 mA | 0.12 mA | - | 0.12 mA |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |