REVISIONS
LTR
A
B
DESCRIPTION
Changes in accordance with NOR 5962-R008-92
Changes in footnotes at the end of table I. Editorial changes
throughout.
DATE
(YR-MO-DA)
91-10-18
92-10-29
APPROVED
M. A. Frye
M. A. Frye
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Rick C. Officer
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
10
B
11
B
12
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
STANDARDIZED
MILITARY
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles E. Besor
e
APPROVED BY
Michael A. Frye
MICROCIRCUIT, LINEAR, CMOS LATCHED
8- AND 16-CHANNEL ANALOG
MULTIPLEXERS, MONOLITHIC SILICON
SIZE
CAGE CODE
DRAWING APPROVAL DATE
90-08-08
REVISION LEVEL
B
SHEET
1
OF
12
AMSC N/A
A
67268
5962-89710
DESC FORM 193
JUL 91
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E660-92
1. SCOPE
1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883,
"Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-89710
01
X
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
Generic number
ADG526A
ADG527A
Circuit function
CMOS 16-channel multiplexer latched
CMOS 8-channel multiplexer latched
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
X
3
Descriptive designator
GDIP1-T28 or CDIP2-T28
CQCC1-N28
28
28
Terminals
Package style
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit
or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and
interchangeable without preference.
1.3 Absolute maximum ratings.
Supply voltage (VDD) to VSS
. . . . . . .44 . . dc . . . . . . . . . . . . . . . . . .
..V ..
Supply voltage (VDD) to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 V dc
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25 V dc
Analog inputs: 1/
Voltage at S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS -2.0 V dc to VDD +2.0 V dc or
20 mA, whichever occurs first
Continuous current, S or D
20 mA
Pulsed current, S or D (1.0 ms duration, 10% duty cycle) . . . . . . . 40 mA
DC input voltages 1/ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS -4.0 V dc to VDD +4.0 V dc or
20 mA, whichever occurs first
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65
C to +150
C
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . +300
C
Power dissipation to +75
C (PD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470 mW 2/
Thermal resistance, junction-to-case (
JC):
Cases X and 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835
Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175
C
1.4 Recommended operating conditions.
Supply voltage to ground (VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -15 V dc
Supply voltage to ground (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15 V dc
Ambient operating temperature range (TA) . . . . . . . . . . . . . . . . . . . . -55
C to +125
C
1/ Overvoltage at A, EN, WR, RS, S, or D will be clamped by diodes. Current should be limited to the maximum rating above.
2/ Derate above TA = +75
C at 6.0 mW/
C.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
B
5962-89710
SHEET
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and bulletin. Unless otherwise specified, the following specification, standards, and
bulletin of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the
solicitation, form a part of this drawing to the extent specified herein.
SPECIFICATION
MILITARY
MIL-M-38510 - Microcircuits, General Specification for.
STANDARDS
MILITARY
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
MIL-STD-1835 - Microcircuit Case Outlines.
BULLETIN
MILITARY
MIL-BUL-103 - List of Standardized Military Drawings (SMD's).
(Copies of the specification, standards, and bulletin required by manufacturers in connection with specific acquisition functions
should be obtained from the contracting activity or as directed by the contracting activity.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing shall take precedence.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the
use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-M-38510 and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth tables. The truth tables shall be as specified on figure 2.
3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall be marked with the PIN listed in
1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-BUL-103 (see 6.6 herein).
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
B
5962-89710
SHEET
3
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55
C
TA
+125
C
unless otherwise specified
Device
type
Group A
Limits
subgroups
Min
Max
Unit
Dual supply
Analog signal
range
Drain-source
"ON"
resistance
VANALOG
TA = +25
C 2/
RDS(ON)
VDD = 14.25 V,
VSS = -14.25 V,
IDS = 1.0 mA, VD = 5.0 V
VS = VD + (IDS x RON)
VDD = 14.25 V,
VSS = -14.25 V,
IDS = 1.0 mA, VD = 5.0 V
VS = VD + (IDS x RON)
VDD = 10.8 V,
VSS = -10.8 V,
IDS = 1.0 mA, VD = 5.0 V
VS = VD + (IDS x RON)
IS(OFF)
3/
ID(OFF)
3/
ID(ON)
3/
IDIFF(OFF)
3/
01,02
01,02
01,02
01,02
Source "OFF"
leakage
current
Drain "OFF"
leakage
current
01,02
01
02
Drain "ON"
leakage
current
01
02
Differential
"OFF" output
leakage
02
4
1
2,3
1
2,3
1
2,3
1
2,3
1
2,3
1
2,3
1
2,3
2,3
-15
+15
300
400
450
600
1.0
50
1.0
200
1.0
100
1.0
200
1.0
100
25
V
$
$
$
nA
nA
nA
nA
See footnotes at end of table.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
B
5962-89710
SHEET
4
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
-55
C
TA
+125
C
unless otherwise specified
Device
type
Group A
Limits
subgroups
Min
Max
Unit
Dual supply - Continued
High level
input current
Low level
input current
Supply current
IINH
IINL
IDD
ISS
tOPEN
tON/
tOFF
(EN)
VDD = 16.5 V, VSS = -16.5 V,
VIN = 16.5 V
VDD = 16.5 V, VSS = -16.5 V,
VIN = 0 V
VDD = 16.5 V, VSS = -16.5 V,
VINH = 2.4/15 V, VINL = 0.8/0 V
VDD = 16.5 V, VSS = -16.5 V,
VINH = 2.4/15 V, VINL = 0.8/0 V
V1 = ±10 V,
See figure 3
4/
See figure 3
4/
01,02
01,02
01,02
Supply current
01,02
Delay time
01,02
Enable delay
time
01,02
1,2,3
1,2,3
1,2,3
1,2,3
9
10,11
9
10,11
25
10
1.0
1.0
1.5
0.2
300
400
µA
µA
mA
mA
ns
ns
Single supply
Analog signal
range
Drain-source
"ON"
resistance
VANALOG
RDS(ON)
IS(OFF)
TA = +25
C 2/
V
SS
= 0 V
VDD = 10.8 V,
VSS = 0 V,
IDS = 0.5 mA, VD = 5.0 V
VS = VD + (IDS * RON)
5/
01,02
01,02
01,02
4
1
2,3
1
2,3
0
+15
700
1000
1.0
50
V
$
nA
Source "OFF"
leakage
current
See footnotes at end of table.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
B
5962-89710
SHEET
5
Microcontroller MCU
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