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X68C64P

Description
EEPROM, 8KX8, 120ns, Parallel, CMOS, PDIP24, PLASTIC, DIP-24
Categorystorage    storage   
File Size155KB,12 Pages
ManufacturerXicor Inc.
Download Datasheet Parametric Compare View All

X68C64P Overview

EEPROM, 8KX8, 120ns, Parallel, CMOS, PDIP24, PLASTIC, DIP-24

X68C64P Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerXicor Inc.
package instructionDIP, DIP24,.6
Reach Compliance Codeunknown
Maximum access time120 ns
Other features100K ENDURANCE WRITE CYCLES; DATA RETENTION = 100 YEARS
command user interfaceNO
Data pollingNO
Data retention time - minimum100
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDIP-T24
JESD-609 codee0
length31.685 mm
memory density65536 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals24
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
page size32 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height4.87 mm
Maximum standby current0.0005 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
width15.24 mm
Maximum write cycle time (tWC)5 ms
X68C64
68XX Microcontroller Family Compatible
64K
X68C64
E
2
Micro-Peripheral
DESCRIPTION
8192 x 8 Bit
FEATURES
CONCURRENT READ WRITE
—Dual Plane Architecture
—Isolates Read/Write Functions
Between Planes
—Allows Continuous Execution of Code
From One Plane While Writing in
the Other Plane
Multiplexed Address/Data Bus
—Direct Interface to Popular 8-bit
Microcontrollers, e.g., Motorola M6801/03,
M68HC11 Family
High Performance CMOS
—Fast Access Time, 120ns
—Low Power
—60mA Maximum Active
—500
µ
A Maximum Standby
Software Data Protection
Block Protect Register
—Individually Set Write Lock Out in 1K Blocks
Toggle Bit Polling
—Early End of Write Detection
Page Mode Write
—Allows up to 32 Bytes to be Written in
One Write Cycle
High Reliability
—Endurance: 100,000 Write Cycles
—Data Retention: 100 Years
The X68C64 is an 8K x 8 E
2
PROM fabricated with
advanced CMOS Textured Poly Floating Gate Technol-
ogy. The X68C64 features a Multiplexed Address and
Data bus allowing a direct interface to a variety of
popular single-chip microcontrollers operating in ex-
panded multiplexed mode without the need for addi-
tional interface circuitry.
The X68C64 is internally configured as two independent
4K x 8 memory arrays. This feature provides the ability
to perform nonvolatile memory updates in one array and
continue operation out of code stored in the other array;
effectively eliminating the need for an auxiliary memory
device for code storage.
To write to the X68C64, a three-byte command
sequence must precede the byte(s) being written. The
X68C64 also provides a second generation software
data protection scheme called Block Protect. Block
Protect can provide write lockout of the entire device or
selected 1K blocks. There are eight 1K x 8 blocks that
can be write protected individually in any combination
required by the user. Block Protect, in addition to Write
Control input, allows the different segments of the memory
to have varying degrees of alterability in normal system
operation.
FUNCTIONAL DIAGRAM
WC
CE
R/W
E
SEL
A8–A11
CONTROL
LOGIC
X
D
E
C
O
D
E
SOFTWARE
DATA
PROTECT
A12
1K BYTES
1K BYTES
1K BYTES
1K BYTES
A12
M
U
X
1K BYTES
1K BYTES
1K BYTES
1K BYTES
A12
AS
L
A
T
C
H
E
S
Y DECODE
I/O & ADDRESS LATCHES AND BUFFERS
A/D0–A/D7
3868 FHD F02
CONCURRENT READ WRITE
is a trademark of Xicor, Inc.
© Xicor, Inc. 1998 Patents Pending
3868-2.7 5/6/98 T0/C0/D1 SH
1
Characteristics subject to change without notice

X68C64P Related Products

X68C64P X68C64PM X68C64SI
Description EEPROM, 8KX8, 120ns, Parallel, CMOS, PDIP24, PLASTIC, DIP-24 EEPROM, 8KX8, 120ns, Parallel, CMOS, PDIP24, PLASTIC, DIP-24 EEPROM, 8KX8, 120ns, Parallel, CMOS, PDSO24, PLASTIC, SOIC-24
Is it Rohs certified? incompatible incompatible incompatible
package instruction DIP, DIP24,.6 DIP, DIP24,.6 SOP, SOP24,.4
Reach Compliance Code unknown unknown unknown
Maximum access time 120 ns 120 ns 120 ns
Other features 100K ENDURANCE WRITE CYCLES; DATA RETENTION = 100 YEARS 100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION; SOFTWARE DATA PROTECTION 100K ENDURANCE WRITE CYCLES; DATA RETENTION = 100 YEARS
command user interface NO NO NO
Data polling NO NO NO
Data retention time - minimum 100 100 100
Durability 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 code R-PDIP-T24 R-PDIP-T24 R-PDSO-G24
JESD-609 code e0 e0 e0
length 31.685 mm 31.685 mm 15.4 mm
memory density 65536 bit 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM EEPROM
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 24 24 24
word count 8192 words 8192 words 8192 words
character code 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 125 °C 85 °C
Minimum operating temperature - -55 °C -40 °C
organize 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP SOP
Encapsulate equivalent code DIP24,.6 DIP24,.6 SOP24,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE
page size 32 words 32 words 32 words
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Programming voltage 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 4.87 mm 4.87 mm 2.65 mm
Maximum standby current 0.0005 A 0.0005 A 0.0005 A
Maximum slew rate 0.06 mA 0.06 mA 0.06 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL MILITARY INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit YES YES YES
width 15.24 mm 15.24 mm 7.5 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms
Maker Xicor Inc. - Xicor Inc.

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