EEWORLDEEWORLDEEWORLD

Part Number

Search

CJ27960K1-16

Description
UVPROM, 128KX8, 16ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44
Categorystorage    storage   
File Size560KB,19 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

CJ27960K1-16 Overview

UVPROM, 128KX8, 16ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44

CJ27960K1-16 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntel
Parts packaging codeQFN
package instructionQCCJ, LDCC44,.7SQ
Contacts44
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time16 ns
I/O typeCOMMON
JESD-30 codeS-CQCC-J44
JESD-609 codee0
length16.51 mm
memory density1048576 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals44
word count131072 words
character code128000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC44,.7SQ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum slew rate0.125 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width16.51 mm

CJ27960K1-16 Related Products

CJ27960K1-16 CJ27960K2-20 N27960K1-16 CJ27960K1-20 CJ27960K2-25
Description UVPROM, 128KX8, 16ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44 UVPROM, 128KX8, 20ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44 OTP ROM, 128KX8, 16ns, CMOS, PQCC44, 0.650 X 0.650 INCH, PLASTIC, LCC-44 UVPROM, 128KX8, 20ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44 UVPROM, 128KX8, 25ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFN QFN LCC QFN QFN
package instruction QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ
Contacts 44 44 44 44 44
Reach Compliance Code unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 16 ns 20 ns 16 ns 20 ns 25 ns
I/O type COMMON COMMON COMMON COMMON COMMON
JESD-30 code S-CQCC-J44 S-CQCC-J44 S-PQCC-J44 S-CQCC-J44 S-CQCC-J44
JESD-609 code e0 e0 e0 e0 e0
length 16.51 mm 16.51 mm 16.5862 mm 16.51 mm 16.51 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type UVPROM UVPROM OTP ROM UVPROM UVPROM
memory width 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of terminals 44 44 44 44 44
word count 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCJ QCCJ QCCJ QCCJ QCCJ
Encapsulate equivalent code LDCC44,.7SQ LDCC44,.7SQ LDCC44,.7SQ LDCC44,.7SQ LDCC44,.7SQ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.57 mm 4.57 mm 4.57 mm 4.57 mm 4.57 mm
Maximum slew rate 0.125 mA 0.125 mA 0.125 mA 0.125 mA 0.125 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND J BEND J BEND J BEND J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 16.51 mm 16.51 mm 16.5862 mm 16.51 mm 16.51 mm
Maker Intel - - Intel Intel

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 486  2173  1304  2155  1297  10  44  27  35  57 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号