UVPROM, 128KX8, 25ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Intel |
| Parts packaging code | QFN |
| package instruction | QCCJ, LDCC44,.7SQ |
| Contacts | 44 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| I/O type | COMMON |
| JESD-30 code | S-CQCC-J44 |
| JESD-609 code | e0 |
| length | 16.51 mm |
| memory density | 1048576 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 44 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC44,.7SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum slew rate | 0.125 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 16.51 mm |
| CJ27960K2-25 | CJ27960K2-20 | N27960K1-16 | CJ27960K1-20 | CJ27960K1-16 | |
|---|---|---|---|---|---|
| Description | UVPROM, 128KX8, 25ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44 | UVPROM, 128KX8, 20ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44 | OTP ROM, 128KX8, 16ns, CMOS, PQCC44, 0.650 X 0.650 INCH, PLASTIC, LCC-44 | UVPROM, 128KX8, 20ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44 | UVPROM, 128KX8, 16ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | QFN | QFN | LCC | QFN | QFN |
| package instruction | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ |
| Contacts | 44 | 44 | 44 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 25 ns | 20 ns | 16 ns | 20 ns | 16 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | S-CQCC-J44 | S-CQCC-J44 | S-PQCC-J44 | S-CQCC-J44 | S-CQCC-J44 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| length | 16.51 mm | 16.51 mm | 16.5862 mm | 16.51 mm | 16.51 mm |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | UVPROM | UVPROM | OTP ROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 44 | 44 | 44 | 44 | 44 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| Maximum slew rate | 0.125 mA | 0.125 mA | 0.125 mA | 0.125 mA | 0.125 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 16.51 mm | 16.51 mm | 16.5862 mm | 16.51 mm | 16.51 mm |
| Maker | Intel | - | - | Intel | Intel |
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