FM3150-BS-H datasheet, PDF - EEWORLD Datasheet

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FM3150-BS-H: DescriptionRectifier Diode, Schottky, 1 Phase, 1 Element, 3A, 150V V(RRM), Silicon, DO-214AA, SMB, 2 PIN; CategoryDiscrete semiconductor diode; File Size93KB，7 Pages; ManufacturerFORMOSA; Websitehttp://www.formosams.com/; Environmental Compliance

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FM3150-BS-H Overview

Rectifier Diode, Schottky, 1 Phase, 1 Element, 3A, 150V V(RRM), Silicon, DO-214AA, SMB, 2 PIN

FM3150-BS-H Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	FORMOSA
package instruction	R-PDSO-F2
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	LOW POWER LOSS
application	EFFICIENCY
Configuration	SINGLE
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
Maximum forward voltage (VF)	0.9 V
JEDEC-95 code	DO-214AA
JESD-30 code	R-PDSO-F2
Maximum non-repetitive peak forward current	80 A
Number of components	1
Phase	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Maximum output current	3 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Maximum repetitive peak reverse voltage	150 V
Maximum reverse current	500 µA
surface mount	YES
technology	SCHOTTKY
Terminal form	FLAT
Terminal location	DUAL

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Chip Schottky Barrier Rectifier

FM320-BS THRU FM3200-BS

List

Formosa MS

List................................................................................................. 1

Package outline............................................................................... 2

Features.......................................................................................... 2

Mechanical data............................................................................... 2

Maximum ratings ............................................................................. 2

Rating and characteristic curves........................................................ 3

Pinning information........................................................................... 4

Marking........................................................................................... 4

Suggested solder pad layout............................................................. 4

Packing information.......................................................................... 5

Reel packing.................................................................................... 6

Suggested thermal profiles for soldering processes............................. 6

High reliability test capabilities........................................................... 7

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

Issued Date

2010/04/12

Revised Date

2011/11/11

Revision

Page.

Page 1

DS-12164B

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