High Speed Operation: 4 MHz (5 V), 2 MHz (1.8 V) Sequential Read

| CAT93C86_13 | CAT93C86HU4E-GT3 | CAT93C86HU4I-GT3 | CAT93C86YI-G | HFE22-B/48-H2T12-R | CAT93C86YI-GT3 | |
|---|---|---|---|---|---|---|
| Description | High Speed Operation: 4 MHz (5 V), 2 MHz (1.8 V) Sequential Read | High Speed Operation: 4 MHz (5 V), 2 MHz (1.8 V) Sequential Read | High Speed Operation: 4 MHz (5 V), 2 MHz (1.8 V) Sequential Read | High Speed Operation: 4 MHz (5 V), 2 MHz (1.8 V) Sequential Read | MINIATURE HIGH POWER LATCHING RELAY | High Speed Operation: 4 MHz (5 V), 2 MHz (1.8 V) Sequential Read |
| Is it Rohs certified? | - | conform to | conform to | conform to | - | conform to |
| Maker | - | ON Semiconductor | ON Semiconductor | ON Semiconductor | - | ON Semiconductor |
| package instruction | - | UDFN-8 | UDFN-8 | TSSOP-8 | - | TSSOP-8 |
| Reach Compliance Code | - | compli | compli | compli | - | compli |
| Spare memory width | - | 8 | 8 | 8 | - | 8 |
| Maximum clock frequency (fCLK) | - | 0.5 MHz | 0.5 MHz | 2 MHz | - | 2 MHz |
| JESD-30 code | - | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 | - | R-PDSO-G8 |
| JESD-609 code | - | e4 | e4 | e4 | - | e4 |
| length | - | 3 mm | 3 mm | 4.4 mm | - | 4.4 mm |
| memory density | - | 16384 bi | 16384 bi | 16384 bi | - | 16384 bi |
| Memory IC Type | - | EEPROM | EEPROM | EEPROM | - | EEPROM |
| memory width | - | 16 | 16 | 16 | - | 16 |
| Humidity sensitivity level | - | 1 | 1 | 1 | - | 1 |
| Number of functions | - | 1 | 1 | 1 | - | 1 |
| Number of terminals | - | 8 | 8 | 8 | - | 8 |
| word count | - | 1024 words | 1024 words | 1024 words | - | 1024 words |
| character code | - | 1000 | 1000 | 1000 | - | 1000 |
| Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS |
| Maximum operating temperature | - | 125 °C | 85 °C | 85 °C | - | 85 °C |
| Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | - | -40 °C |
| organize | - | 1KX16 | 1KX16 | 1KX16 | - | 1KX16 |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| encapsulated code | - | HVSON | HVSON | TSSOP | - | TSSOP |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | - | SERIAL | SERIAL | SERIAL | - | SERIAL |
| Maximum seat height | - | 0.55 mm | 0.55 mm | 1.2 mm | - | 1.2 mm |
| Serial bus type | - | MICROWIRE | MICROWIRE | MICROWIRE | - | MICROWIRE |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| Minimum supply voltage (Vsup) | - | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | - | 5 V |
| surface mount | - | YES | YES | YES | - | YES |
| technology | - | CMOS | CMOS | CMOS | - | CMOS |
| Temperature level | - | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| Terminal surface | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | - | NO LEAD | NO LEAD | GULL WING | - | GULL WING |
| Terminal pitch | - | 0.5 mm | 0.5 mm | 0.65 mm | - | 0.65 mm |
| Terminal location | - | DUAL | DUAL | DUAL | - | DUAL |
| width | - | 2 mm | 2 mm | 3 mm | - | 3 mm |