LR33310MC-33 datasheet, PDF - EEWORLD Datasheet

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LR33310MC-33: DescriptionIC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,METAL; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，29 Pages; ManufacturerAVAGO; Websitehttp://www.avagotech.com/

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LR33310MC-33 Overview

IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,METAL

LR33310MC-33 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AVAGO
package instruction	QFP, QFP160,1.2SQ
Reach Compliance Code	compliant
bit size	32
JESD-30 code	S-MQFP-G160
JESD-609 code	e0
Number of terminals	160
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	METAL
encapsulated code	QFP
Encapsulate equivalent code	QFP160,1.2SQ
Package shape	SQUARE
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
speed	33 MHz
Maximum slew rate	510 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	QUAD
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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LR33310MC-33 Related Products

	LR33310MC-33	LR33300MC-20	LR33310MC-50	LR33300MC-25	LR33310MC-40
Description	IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,METAL	IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,METAL	IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,METAL
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	AVAGO	AVAGO	AVAGO	AVAGO	AVAGO
package instruction	QFP, QFP160,1.2SQ	QFP, QFP160,1.2SQ	QFP, QFP160,1.2SQ	QFP, QFP160,1.2SQ	QFP, QFP160,1.2SQ
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
bit size	32	32	32	32	32
JESD-30 code	S-MQFP-G160	S-PQFP-G160	S-MQFP-G160	S-PQFP-G160	S-MQFP-G160
JESD-609 code	e0	e0	e0	e0	e0
Number of terminals	160	160	160	160	160
Maximum operating temperature	70 °C	70 °C	50 °C	70 °C	70 °C
Package body material	METAL	PLASTIC/EPOXY	METAL	PLASTIC/EPOXY	METAL
encapsulated code	QFP	QFP	QFP	QFP	QFP
Encapsulate equivalent code	QFP160,1.2SQ	QFP160,1.2SQ	QFP160,1.2SQ	QFP160,1.2SQ	QFP160,1.2SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	33 MHz	20 MHz	50 MHz	25 MHz	40 MHz
Maximum slew rate	510 mA	275 mA	765 mA	345 mA	620 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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