IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,METAL
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AVAGO |
| package instruction | QFP, QFP160,1.2SQ |
| Reach Compliance Code | compliant |
| bit size | 32 |
| JESD-30 code | S-MQFP-G160 |
| JESD-609 code | e0 |
| Number of terminals | 160 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | METAL |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP160,1.2SQ |
| Package shape | SQUARE |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| speed | 40 MHz |
| Maximum slew rate | 620 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.635 mm |
| Terminal location | QUAD |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| LR33310MC-40 | LR33300MC-20 | LR33310MC-50 | LR33300MC-25 | LR33310MC-33 | |
|---|---|---|---|---|---|
| Description | IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,METAL | IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,METAL | IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,QFP,160PIN,METAL |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | AVAGO | AVAGO | AVAGO | AVAGO | AVAGO |
| package instruction | QFP, QFP160,1.2SQ | QFP, QFP160,1.2SQ | QFP, QFP160,1.2SQ | QFP, QFP160,1.2SQ | QFP, QFP160,1.2SQ |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| bit size | 32 | 32 | 32 | 32 | 32 |
| JESD-30 code | S-MQFP-G160 | S-PQFP-G160 | S-MQFP-G160 | S-PQFP-G160 | S-MQFP-G160 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 160 | 160 | 160 | 160 | 160 |
| Maximum operating temperature | 70 °C | 70 °C | 50 °C | 70 °C | 70 °C |
| Package body material | METAL | PLASTIC/EPOXY | METAL | PLASTIC/EPOXY | METAL |
| encapsulated code | QFP | QFP | QFP | QFP | QFP |
| Encapsulate equivalent code | QFP160,1.2SQ | QFP160,1.2SQ | QFP160,1.2SQ | QFP160,1.2SQ | QFP160,1.2SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| speed | 40 MHz | 20 MHz | 50 MHz | 25 MHz | 33 MHz |
| Maximum slew rate | 620 mA | 275 mA | 765 mA | 345 mA | 510 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
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