EEWORLDEEWORLDEEWORLD

Part Number

Search

3SMAJ5954BHE3-TP

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
File Size215KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

3SMAJ5954BHE3-TP Online Shopping

Suppliers Part Number Price MOQ In stock  
3SMAJ5954BHE3-TP - - View Buy Now

3SMAJ5954BHE3-TP Overview

Zener Diode,

3SMAJ5954BHE3-TP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
package instructionR-PDSO-C2
Reach Compliance Codenot_compliant
ECCN codeEAR99
Samacsys Description3.0 Watt Surface Mount Silicon Zener Diodes 10V to 200V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance700 Ω
Maximum forward voltage (VF)1.5 V
JEDEC-95 codeDO-214AC
JESD-30 codeR-PDSO-C2
Maximum knee impedance6500 Ω
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation3 W
GuidelineAEC-Q101
Nominal reference voltage160 V
Maximum reverse current1 µA
Reverse test voltage121.6 V
surface mountYES
technologyZENER
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current2.3 mA
MCC
Micro Commercial Components
R
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
3SMAJ5925BHE3
THRU
3SMAJ5956BHE3
3.0 Watt
Surface Mount
Silicon
Zener Diodes

Features
AEC-Q101
Qualified
Low Inductance, Low Profile Mounting
Glasss Passivated Junction
High specified maximum current(IZM)when adequately heat sinking
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Halogen
free
Surface Mount Application
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
0
DO-214AC

(SMA) (LEAD FRAME)



J
H
Maximum Ratings @ 25
o
C Unless Otherwise Specified
A
C
Junction
to
Lead
Junction
to
Ambient
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
Thermal
Resistance
V
F
P
d
T
J
,
T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note:
2)
(Note:
3)
E
F
G
DIMENSIONS
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
D
B
R
thJL
R
thJA
25
/W
135
/W
DIM
A
B
C
D
E
F
G
H
J
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085"
Note:
1.
2.
3.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
Forward Current @ 200mA.
Mounted on 5.0mm2 (1oz thick) Iand areas.
Lead temperature at TL=75
o
C
Lead temperature at T
A
=15
O
C
0.070"
Revision:
A
www.mccsemi.com
1 of 4
2015/06/11
Does this mean that the maximum angle the pin can extend outward is 15 degrees?
Does this mean that the maximum angle the pin can extend outward is 15 degrees?...
smartygt PCB Design
Atmel SAM D21 development board trial experience + development board driver installation and simple use of Atmel Studio
[i=s]This post was last edited by wgsxsm on 2014-9-16 21:59[/i] In 2010, I had contact with Atmel's MCU: AVR microcontroller. At that time, I thought Atmel's products were very good, and the most impr...
wgsxsm MCU
Driver issues under WinCE6
The stream device driver under WinCE5.0 is a user-mode DLL. When we write a driver, we only need to write a dynamic library and export the functions it needs. The architecture of CE6.0 is said to have...
kaya Embedded System
ADI Resource Sharing
ADI Resource Sharing...
燚元帅 Analog electronics
Let’s discuss the relationship between transformers and inductors again.
The issue discussed this time is the relationship between transformers and inductors. It should be noted that the scope of this topic is limited to "the relationship between transformers and inductors...
bigbat Power technology
NandFlash partition problem? -- Help!
I just learned embedded system by myself, and I don't understand many questions. Please help me, embedded system seniors passing by! In kernel transplantation, why should NandFlash be partitioned? Isn...
tsb64 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 171  1638  2317  1433  86  4  33  47  29  2 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号