PPC21231BLF7 datasheet, PDF - EEWORLD Datasheet

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PPC21231BLF7: DescriptionRES,SMT,METAL GLAZE,1.23K OHMS,500WV,.1% +/-TOL,-25,25PPM TC; CategoryPassive components The resistor; File Size178KB，3 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/; Environmental Compliance

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PPC21231BLF7 Overview

RES,SMT,METAL GLAZE,1.23K OHMS,500WV,.1% +/-TOL,-25,25PPM TC

PPC21231BLF7 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	TT Electronics plc
Reach Compliance Code	compliant
ECCN code	EAR99
structure	Chip
Manufacturer's serial number	PPC
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package diameter	2.67 mm
Package length	9.32 mm
Package form	SMT
method of packing	TR
Rated power dissipation(P)	2 W
resistance	1230 Ω
Resistor type	FIXED RESISTOR
series	PPC
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	-25,25 ppm/°C
Tolerance	0.1%
Operating Voltage	500 V

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Metal Glaze

™

Surface Mount

Precision Power Chip

PPC Series

•

Surge tolerant

•

Up to 1000 volts

•

Tight TCR - 25 ppm/°C

•

Tolerance down to ±0.1%

Solder over nickel

barrier

High

temperature

dielectric

coating

Metal Glaze™ thick

film element fired

at 1000°C to solid

ceramic substrate

Electrical Data

Size

Code

Industry

Footprint

1206

2010

2512

3610

IRC

Type

PPC1/8

PPC1/2

PPC1

PPC2

Power

Rating at

70°C (W)

1/8 W

1/2 W

2W 1.33W

Working

Voltage

200

300

350

500

Resistance

Range

(ohms)

100 - 10K

0.1% (B)

0.25% (C)

0.5% (D)

Tolerance

(±%)

Qty /

Reel (7")

2500

1500

N/A

Qty /

Reel (13")

10000

5000

1500

Environmental Data

Characteristics

Temperature Coefﬁcient

Thermal Shock

Low Temperature Operation

Short Time Overload

High Temperature Exposure

Resistance to Bonding

Exposure

Solderability

Moisture Resistance

Life Test

Terminal Adhesion Strength

Maximum Change

As speciﬁed

±0.5% + 0.01 ohm

±0.25% + 0.01 ohm

±0.5% + 0.01 ohm

±0.25% + 0.01 ohm

95% minimum coverage

±0.5% + 0.01 ohm

±1% + 0.01 ohm

no mechanical damage

Test Method

MIL-R-55342E Par 4.7.9 (-55°C + 125°C)

MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)

MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)

MIL-R-55342E Par 4.7.5 2.5 x

√

for 5 seconds

MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)

MIL-R-55342E Par 4.7.7 (Reﬂow soldered to board at 260°C

for 10 seconds)

MIL-STD-202, Method 208 (245°C for 5 seconds)

MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)

MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)

1200 gram push from underside of mounted chip for 60

seconds

Chip mounted in center of 90mm long board, deﬂected 1mm

so as to exert pull on chip contacts for 5 seconds

General Note

IRC reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

Wire and Film Technologies Division

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

A subsidiary of

TT electronics plc

PPC Series Issue November 2008 Sheet 1 of 3

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