S-22S10I01/10 datasheet, PDF - EEWORLD Datasheet

S-22S10I01/10: DescriptionNon-Volatile SRAM, 64X4, 200ns, CMOS, PDIP18; Categorystorage storage; File Size607KB，15 Pages; ManufacturerABLIC

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S-22S10I01/10 Overview

Non-Volatile SRAM, 64X4, 200ns, CMOS, PDIP18

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ABLIC
package instruction	DIP, DIP18,.3
Reach Compliance Code	compliant
Maximum access time	200 ns
JESD-30 code	R-PDIP-T18
JESD-609 code	e0
Memory IC Type	NON-VOLATILE SRAM
memory width	4
Number of terminals	18
word count	64 words
character code	64
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64X4
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	0.03 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	S-22S10I01/10	S-22S10RF01/10
Description	Non-Volatile SRAM, 64X4, 200ns, CMOS, PDIP18	Non-Volatile SRAM, 64X4, 200ns, CMOS, PDSO18
Is it Rohs certified?	incompatible	incompatible
Maker	ABLIC	ABLIC
package instruction	DIP, DIP18,.3	SOP, SOP18,.3
Reach Compliance Code	compliant	compliant
Maximum access time	200 ns	200 ns
JESD-30 code	R-PDIP-T18	R-PDSO-G18
JESD-609 code	e0	e0
Memory IC Type	NON-VOLATILE SRAM	NON-VOLATILE SRAM
memory width	4	4
Number of terminals	18	18
word count	64 words	64 words
character code	64	64
Maximum operating temperature	85 °C	70 °C
organize	64X4	64X4
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP
Encapsulate equivalent code	DIP18,.3	SOP18,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	0.03 mA	0.02 mA
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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