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BYD57G

Description
Rectifier Diode,
CategoryDiscrete semiconductor    diode   
File Size118KB,3 Pages
ManufacturerEIC [EIC discrete Semiconductors]
Download Datasheet Parametric Compare View All

BYD57G Overview

Rectifier Diode,

BYD57G Parametric

Parameter NameAttribute value
MakerEIC [EIC discrete Semiconductors]
Reach Compliance Codecompliant
ECCN codeEAR99

BYD57G Preview

Certificate TH97/10561QM
Certificate TW00/17276EM
BYD57D - BYD57V
PRV :
200
-
1400
Volts
Io :
1.0 - 1.2
Amperes
FEATURES :
*
*
*
*
*
Glass passivated
High maximum operating temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
* Smallest surface mount rectifier outline
* Pb / RoHS Free
ULTRA-FAST SOFT-RECOVERY
CONTROLLED AVALANCHE RECTIFIERS
MELF (Plastic)
Cathode Mark
φ
0.102 (2.6)
0.094 (2.4)
0.022(0.55)
0.205(5.2)
0.189(4.8)
MECHANICAL DATA :
* Case : Molded plastic
* Terminals : Plated Terminals, solderable per
MIL-STD-750 Method 2026
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.116 gram
Dimensions in inches and ( millimeters )
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25 °C ambient temperature unless otherwise specifie
d.
RATING
Maximum Repetitive Peak Reverse Voltage
Maximum Continuous Reverse Voltage
Min. Reverse Avalanche Breakdown Voltage @ I
R
= 0.1 mA
Maximum Average Forward Current
Maximum Non-Repetitive Peak Forward Surge Current (Note 3)
Maximum Repetitive Peak Forward Current at Ttp = 85 °C
Maximum Forward Voltage at I
F
= 1.0 A ; T
J
= 25 °C
Maximum Reverse Current at V
R
=V
RRMmax
Maximum Reverse Recovery Time (Note 4)
Thermal Resistance from Junction to Tie-Point
Thermal Resistance from Junction to Ambient (Note 5)
Junction Temperature Range
Storage Temperature Range
T
J
= 25 °C
T
J
= 165 °C
SYMBOL
V
RRM
V
R
V
(BR)R-min
I
F(AV)
I
FSM
I
FRM
V
F
I
R
I
R(H)
Trr
R
th j-tp
R
th j-a
T
J
T
STG
BYD BYD BYD BYD BYD BYD BYD
UNIT
57D 57G 57J 57K 57M 57U 57V
200
200
300
400
400
500
600
600
700
1.0
(1)
0.4
(2)
5
8.5
3.6
5.0
100
30
30
150
- 65 to + 175
- 65 to + 175
75
150
11
2.3
800 1000 1200 1400
800 1000 1200 1400
900 1100 1300 1500
1.2
(1)
V
V
V
A
A
A
V
μA
μA
ns
K/W
K/W
°C
°C
Notes :
(1) Ttp = 85 °C; see Fig. 1and 2; averaged over any 20 ms period; see also Fig.5 and 6.
(2) Tamb = 60 °C; PCB mounting ; see Fig. 3 and 4; averaged over any 20 ms period; see also Fig.5 and 6.
(3) t=10ms half sine wave; Tj = Tjmax prior to surge; V
R
= V
RRMmax.
(4) Reverse Recovery Test Conditions :
I
F
= 0.5 A, I
R
= 1.0 A, Irr = 0.25 A.
(5) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-lay
40
μm.
Page 1 of 3
Rev. 01 : November 11, 2006
Certificate TH97/10561QM
Certificate TW00/17276EM
RATING AND CHARACTERISTIC CURVES ( BYD57D - BYD57V )
FIG.1 - MAXIMUM PERMISSIBLE AVERAGE FORWARD
CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE
2.0
FIG.2 - MAXIMUM PERMISSIBLE AVERAGE FORWARD
CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE
2.0
BYD57D to M
BYD57U to V
AVERAGE FORWARD
CURRENT, I
F(AV)
(A)
1.2
AVERAGE FORWARD
CURRENT, I
F(AV)
(A)
0
40
80
120
160
200
1.6
1.6
1.2
0.8
0.8
0.4
0.4
0
0
0
40
80
120
160
200
TIE-POINT TEMPERATURE, Ttp (
°
C)
FIG.3 - MAXIMUM PERMISSIBLE AVERAGE FORWARD
CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE
AVERAGE FORWARD CURRENT, I
F(AV)
(A)
0.6
TIE-POINT TEMPERATURE, Ttp (
°
C)
FIG.4 - MAXIMUM PERMISSIBLE AVERAGE FORWARD
CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE
0.6
AVERAGE FORWARD CURRENT, I
F(AV)
(A)
BYD57D to M
0.5
BYD57U to V
0.4
0.4
0.3
0.2
0.2
0.1
0
0
40
80
120
160
200
0
0
40
80
120
160
200
AMBIENT TEMPERATURE, Tamp (
°
C)
FIG.5 - MAXIMUM STEADY STATE POWER DISSIPATION
AS A FUNCTION OF AVERAGE FORWARD CURRENT
3
AMBIENT TEMPERATURE, Tamp (
°
C)
FIG.6 - MAXIMUM STEADY STATE POWER DISSIPATION
AS A FUNCTION OF AVERAGE FORWARD CURRENT
6
POWER DISSIPATION, P
D
(W)
a =3 2.5
2
1.57 1.42
POWER DISSIPATION, P
D
(W)
BYD57U to V
5
4
3
2
a =3
2.5
2
1.57
1.42
2
1
BYD57D to M
1
a = I
F(RMS)
/I
F(AV)
; V
R
= V
RRMmax
;
δ
= 0.5
0
0
0.4
0.8
1.2
1.6
2.0
a = I
F(RMS)
/I
F(AV)
; V
R
= V
RRMmax
;
δ
= 0.5
0
0
0.5
AVERAGE FORWARD CURRENT, I
F(AV)
(A)
AVERAGE FORWARD CURRENT, I
F(AV)
(A)
Page 2 of 3
Rev. 01 : November 11, 2006
Certificate TH97/10561QM
Certificate TW00/17276EM
RATING AND CHARACTERISTIC CURVES ( BYD57D- BYD57V )
FIG.7 - FORWARD CURRENT AS FUNCTION
OF FORWARD VOLTAGE
FIG.8 - FORWARD CURRENT AS FUNCTION
OF FORWARD VOLTAGE
4
4
BYD77A to D
BYD77E to G
FORWARD CURRENT, I
F
(A)
3
FORWARD CURRENT, I
F
(A)
T
J
= 25 °C
3
T
J
= 25 °C
2
2
1
1
0
0
2
4
6
8
0
0
1
2
3
4
FORWARD VOLTAGE, V
F
(V)
FORWARD VOLTAGE, V
F
(V)
FIG.9 - REVERSE CURRENT AS FUNCTION
OF JUNCTION TEMPERATURE
1000
REVERSE CURRENT, I
R
(μA)
100
V
R
=V
RRMmax
10
1
0
10
200
JUNCTION TEMPERATURE, T
J
( °C)
Page 3 of 3
Rev. 01 : November 11, 2006

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Reach Compliance Code compliant compliant
ECCN code EAR99 EAR99
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