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MH51204JA-15

Description
DRAM Module, 512KX4, 150ns, NMOS, SIMM-24
Categorystorage    storage   
File Size455KB,10 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
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MH51204JA-15 Overview

DRAM Module, 512KX4, 150ns, NMOS, SIMM-24

MH51204JA-15 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMitsubishi
Parts packaging codeSIMM
package instruction, SIP24,.2
Contacts24
Reach Compliance Codeunknown
ECCN codeEAR99
access modePAGE
Maximum access time150 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeSEPARATE
JESD-30 codeR-XSMA-T24
JESD-609 codee0
memory density2097152 bit
Memory IC TypeDRAM MODULE
memory width4
Number of functions1
Number of ports1
Number of terminals24
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX4
Output characteristics3-STATE
Package body materialUNSPECIFIED
Encapsulate equivalent codeSIP24,.2
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
refresh cycle256
Maximum slew rate0.24 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyNMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED

MH51204JA-15 Preview

This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer

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Description DRAM Module, 512KX4, 150ns, NMOS, SIMM-24 DRAM Module, 512KX4, 120ns, NMOS, SIMM-24 DRAM Module, 512KX4, 100ns, NMOS, SIMM-24 DRAM Module, 512KX4, 85ns, NMOS, SIMM-24
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Mitsubishi Mitsubishi Mitsubishi Mitsubishi
Parts packaging code SIMM SIMM SIMM SIMM
package instruction , SIP24,.2 , SIP24,.2 , SIP24,.2 , SIP24,.2
Contacts 24 24 24 24
Reach Compliance Code unknown unknown unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99
access mode PAGE PAGE PAGE PAGE
Maximum access time 150 ns 120 ns 100 ns 85 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-XSMA-T24 R-XSMA-T24 R-XSMA-T24 R-XSMA-T24
JESD-609 code e0 e0 e0 e0
memory density 2097152 bit 2097152 bit 2097152 bi 2097152 bi
Memory IC Type DRAM MODULE DRAM MODULE DRAM MODULE DRAM MODULE
memory width 4 4 4 4
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 24 24 24 24
word count 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 512KX4 512KX4 512KX4 512KX4
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Encapsulate equivalent code SIP24,.2 SIP24,.2 SIP24,.2 SIP24,.2
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 256 256 256 256
Maximum slew rate 0.24 mA 0.26 mA 0.28 mA 0.3 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology NMOS NMOS NMOS NMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location SINGLE SINGLE SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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