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DSP56304PV66

Description
Digital Signal Processor, 24-Bit Size, 24-Ext Bit, 66MHz, CMOS, PQFP144, TQFP-144
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size970KB,165 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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DSP56304PV66 Overview

Digital Signal Processor, 24-Bit Size, 24-Ext Bit, 66MHz, CMOS, PQFP144, TQFP-144

DSP56304PV66 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
package instructionTQFP-144
Reach Compliance Codeunknown
ECCN code3A001.A.3
Address bus width18
barrel shifterYES
bit size24
boundary scanYES
maximum clock frequency66 MHz
External data bus width24
FormatFIXED POINT
Integrated cacheNO
Internal bus architectureMULTIPLE
JESD-30 codeS-PQFP-G144
JESD-609 codee0
length20 mm
low power modeYES
Number of DMA channels6
Number of external interrupt devices5
Number of serial I/Os2
Number of terminals144
Number of timers3
On-chip data RAM width24
On-chip program ROM width24
Maximum operating temperature100 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP144,.87SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
RAM (number of words)5020
ROM programmabilityMROM
Maximum seat height1.6 mm
Maximum slew rate120 mA
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width20 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER

DSP56304PV66 Preview

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by:
DSP56304/D
DSP56304
Advance Information
24-BIT DIGITAL SIGNAL PROCESSOR
Motorola designed the ROM-based DSP56304 to support multifunction wireless and
embedded DSP applications. In addition to the large on-chip ROM spaces, the DSP56304 also
has a ROM patch feature that facilitates updates to the on-chip mask Program ROM-based
on-chip software. The DSP56304 includes a triple timer module, Host Interface (HI08), an
Enhanced Synchronous Serial Interface (ESSI), and a Serial Communications Interface (SCI).
The DSP56300 core family includes a Phase Lock Loop (PLL), External Memory Interface
(EMI), Data Arithmetic Logic Unit (Data ALU), 24-bit addressing, instruction cache, and
DMA. The DSP56304 offers 66/80 MIPS using an internal 66/80 MHz clock at 3.0–3.6 volts.
16
6
6
3
Memory Expansion Area
Triple
Timer
Host
Interface
HI08
ESSI
Interface
SCI
Interface
Program RAM
1024
×
24*
Program ROM
33792
×
24
*default
PIO_EB
PM_EB
Y Data
X Data
RAM
RAM
1792
×
24*
3328
×
24*
ROM
ROM
9216
×
24
9216
×
24
*default
*default
XM_EB
YM_EB
Peripheral
Expansion Area
Address
Generation
Unit
Six Channel
DMA Unit
Boot-
strap
ROM
YAB
XAB
PAB
DAB
External
Address
Bus
Switch
External
Bus
Interface
&
I-Cache
Control
18
Address
24-Bit
DSP56300
Core
DDB
YDB
13
Control
Internal
Data
Bus
Switch
EXTAL
XTAL
Clock
Generator
PLL
2
RESET
PINIT/NMI
Program
Interrupt
Controller
Program
Decode
Controller
MODA/IRQA
MODB/IRQB
MODC/IRQC
MODD/IRQD
Program
Address
Generator
XDB
PDB
GDB
External
Data Bus
Switch
24
Data
Data ALU
24
×
24 + 56
56-bit MAC JTAG
Two 56-bit Accumulators
OnCE™
56-bit Barrel Shifter
Power
Mngmnt
5
DE
AA0853
Figure 1
DSP56304 Block Diagram
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Preliminary Data
©1996 MOTOROLA, INC.
TABLE OF CONTENTS
SECTION 1
SECTION 2
SECTION 3
SECTION 4
SECTION 5
APPENDIX A
SIGNAL/CONNECTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . 1-1
SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
PACKAGING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
DESIGN CONSIDERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
POWER CONSUMPTION BENCHMARK . . . . . . . . . . . . . . . . . . A-1
INDEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Index-1
FOR TECHNICAL ASSISTANCE:
Telephone:
Email:
Internet:
1-800-521-6274
dsphelp@dsp.sps.mot.com
http://www.motorola-dsp.com
Data Sheet Conventions
This data sheet uses the following conventions:
OVERBAR
“asserted”
“deasserted”
Examples:
Used to indicate a signal that is active when pulled low (For example, the RESET
pin is active when low.)
Means that a high true (active high) signal is high or that a low true (active low)
signal is low
Means that a high true (active high) signal is low or that a low true (active low)
signal is high
Signal/Symbol
PIN
PIN
PIN
PIN
Note:
Logic State
True
False
True
False
Signal State
Asserted
Deasserted
Asserted
Deasserted
Voltage
V
IL
/V
OL
V
IH
/V
OH
V
IH
/V
OH
V
IL
/V
OL
Values for V
IL
, V
OL
, V
IH
, and V
OH
are defined by individual product specifications.
Preliminary Data
ii
DSP56304/D
MOTOROLA
DSP56304
Features
FEATURES
DSP56304 FEATURES
High Performance DSP56300 Core
66/80 Million Instructions Per Second (MIPS) with a 66/80 MHz clock
Object code compatible with the DSP56000 core
Highly parallel instruction set
Fully pipelined 24
×
24-bit parallel Multiplier-Accumulator (MAC)
56-bit parallel barrel shifter
24-bit or 16-bit arithmetic support under software control
Position independent code support
Addressing modes optimized for DSP applications
On-chip instruction cache controller
On-chip memory-expandable hardware stack
Nested hardware DO loops
Fast auto-return interrupts
On-chip concurrent six-channel DMA controller
On-chip Phase Lock Loop (PLL) and clock generator
On-Chip Emulation (OnCE™) module
JTAG Test Access Port (TAP)
Address Tracing mode reflects internal accesses at the external port
Preliminary Data
MOTOROLA
DSP56304/D
iii
DSP56304
DSP56304 Features
On-chip Memories
Program RAM, Instruction Cache, X data RAM, and Y data RAM size is
programmable:
Switch
Mode
disabled
disabled
enabled
enabled
Program
RAM Size
1024
×
24-bit
0
3584
×
24-bit
2560
×
24-bit
Instruction
Cache Size
0
1024
×
24-bit
0
1024
×
24-bit
X Data RAM
Size
3328
×
24-bit
3328
×
24-bit
2048
×
24-bit
2048
×
24-bit
Y Data RAM
Size
1792
×
24-bit
1792
×
24-bit
512
×
24-bit
512
×
24-bit
Instruction
Cache
disabled
enabled
disabled
enabled
33, 792
×
24-bit Program ROM with Patch mode update capability using
instruction cache memory space
9,216
×
24-bit X data ROM and 9,216
×
24-bit Y data ROM
192
×
24-bit bootstrap ROM
Off-chip Memory Expansion
Data memory expansion to two 256 K
×
24-bit word memory spaces (the
usage of address attribute pins and/or DRAM interface may further
extend the data memory expansion up to two 16 M
×
24-bit words
memory space)
Program memory expansion to one 256 K
×
24-bit word memory space
(the usage of address attribute pins and/or DRAM interface may further
extend the program memory expansion up to two 16 M
×
24-bit words
memory space)
External memory expansion port
Chip select logic requires no additional circuitry to interface to SRAMs
and SSRAMs
On-chip DRAM controller requires no additional circuitry to interface to
DRAMs
Preliminary Data
iv
DSP56304/D
MOTOROLA
DSP56304
Target Applications
On-chip Peripherals
8-bit parallel Host Interface (HI08), ISA-compatible bus interface,
providing a cost-effective solution for applications not requiring the PCI
bus
Two Enhanced Synchronous Serial Interfaces (ESSI0 and ESSI1)
Serial Communications Interface (SCI) with baud rate generator
Triple timer module
Up to thirty-four programmable General Purpose I/O pins (GPIO),
depending on which peripherals are enabled
Reduced Power Dissipation
Very low power CMOS design
Wait and Stop low power standby modes
Fully-static logic, operation frequency down to DC
Optimized power management circuitry
TARGET APPLICATIONS
The DSP56304 is intended for use in embedded multifunction DSP applications
requiring large on-board ROM spaces, such as wireless products that combine
standard cellular phone operation with options such as two-way digital paging
and fax capability in one unit.
Preliminary Data
MOTOROLA
DSP56304/D
v

DSP56304PV66 Related Products

DSP56304PV66 DSP56304PV80 DSP56304GC80
Description Digital Signal Processor, 24-Bit Size, 24-Ext Bit, 66MHz, CMOS, PQFP144, TQFP-144 Digital Signal Processor, 24-Bit Size, 24-Ext Bit, 80MHz, CMOS, PQFP144, TQFP-144 Digital Signal Processor, 24-Bit Size, 24-Ext Bit, 80MHz, CMOS, PBGA196, PLASTIC, BGA-196
Is it Rohs certified? incompatible incompatible incompatible
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
package instruction TQFP-144 TQFP-144 PLASTIC, BGA-196
Reach Compliance Code unknown unknown unknown
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3
Address bus width 18 18 18
barrel shifter YES YES YES
bit size 24 24 24
boundary scan YES YES YES
maximum clock frequency 66 MHz 80 MHz 80 MHz
External data bus width 24 24 24
Format FIXED POINT FIXED POINT FIXED POINT
Integrated cache NO NO NO
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE
JESD-30 code S-PQFP-G144 S-PQFP-G144 S-PBGA-B196
JESD-609 code e0 e0 e0
length 20 mm 20 mm 15 mm
low power mode YES YES YES
Number of DMA channels 6 6 6
Number of external interrupt devices 5 5 5
Number of serial I/Os 2 2 2
Number of terminals 144 144 196
Number of timers 3 3 3
On-chip data RAM width 24 24 24
On-chip program ROM width 24 24 24
Maximum operating temperature 100 °C 100 °C 100 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP BGA
Encapsulate equivalent code QFP144,.87SQ,20 QFP144,.87SQ,20 BGA196,14X14,40
Package shape SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
RAM (number of words) 5020 5020 5020
ROM programmability MROM MROM MROM
Maximum seat height 1.6 mm 1.6 mm 1.75 mm
Maximum slew rate 120 mA 145 mA 145 mA
Maximum supply voltage 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING BALL
Terminal pitch 0.5 mm 0.5 mm 1 mm
Terminal location QUAD QUAD BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 20 mm 20 mm 15 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER

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