are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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ÉÉÉ
SIDE VIEW
eD
BOTTOM VIEW
0.05 C
ÈÈ
TOP VIEW
A2
A
eD/2
RECOMMENDED
SOLDERING FOOTPRINT*
C
SEATING
PLANE
A1
0.87
PACKAGE
OUTLINE
eE
0.44
0.25
0.50
5X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
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