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IS63WV1024LL-20HI

Description
Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 8 X 13.40 MM, PLASTIC, STSOP1-32
Categorystorage    storage   
File Size104KB,16 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
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IS63WV1024LL-20HI Overview

Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 8 X 13.40 MM, PLASTIC, STSOP1-32

IS63WV1024LL-20HI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSOP1
package instruction8 X 13.40 MM, PLASTIC, STSOP1-32
Contacts32
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time20 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G32
JESD-609 codee0
length11.8 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLSSOP
Encapsulate equivalent codeTSSOP32,.56,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Certification statusNot Qualified
Maximum seat height1.25 mm
Maximum standby current0.00002 A
Minimum standby current2.5 V
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
IS63WV1024LL
128K x 8 HIGH-SPEED CMOS STATIC RAM
ISSI
FEBRUARY 2004
®
FEATURES
• High-speed access time: 20ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for
greater noise immunity
• Easy memory expansion with
CE
and
OE
options
CE
power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single 2.5V-3.6V V
DD
power supply
• Packages available:
– 32-pin TSOP (Type II)
– 32-pin sTSOP (Type I)
– 36-Ball miniBGA (6mm x 8mm)
– 32-pin SOJ (300-mil)
DESCRIPTION
The
ISSI
IS63WV1024LL is a very high-speed, low
power, 131,072-word by 8-bit CMOS static RAM. The
IS63WV1024LL is fabricated using
ISSI
's
high-performance CMOS technology. This highly reliable
process coupled with innovative circuit design
techniques, yields higher performance and low power
consumption devices.
When
CE
is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down to 250 µW (typical) with CMOS input
levels.
The IS63WV1024LL operates from a single V
DD
power
supply. The IS63WV1024LL is available in 32-pin TSOP
(Type II), 32-pin sTSOP (Type I), 36-Ball miniBGA (6mm
x 8mm), and 32-pin SOJ (300-mil) packages.
FUNCTIONAL BLOCK DIAGRAM
A0-A16
DECODER
128K X 8
MEMORY ARRAY
VDD
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CE
OE
WE
CONTROL
CIRCUIT
Copyright © 2004 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice.
ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
02/02/04
1

IS63WV1024LL-20HI Related Products

IS63WV1024LL-20HI IS63WV1024LL-20BI IS63WV1024LL-20TI IS63WV1024LL-20JI
Description Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 8 X 13.40 MM, PLASTIC, STSOP1-32 Standard SRAM, 128KX8, 20ns, CMOS, PBGA36, 6 X 8 MM, MINI, BGA-36 Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, PLASTIC, TSOP2-32 Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code TSOP1 BGA TSOP2 SOJ
package instruction 8 X 13.40 MM, PLASTIC, STSOP1-32 6 X 8 MM, MINI, BGA-36 PLASTIC, TSOP2-32 0.300 INCH, PLASTIC, SOJ-32
Contacts 32 36 32 32
Reach Compliance Code compliant compliant compliant compliant
ECCN code 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Maximum access time 20 ns 20 ns 20 ns 20 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G32 R-PBGA-B36 R-PDSO-G32 R-PDSO-J32
JESD-609 code e0 e0 e0 e0
length 11.8 mm 8 mm 20.95 mm 20.955 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8
Humidity sensitivity level 3 3 3 3
Number of functions 1 1 1 1
Number of terminals 32 36 32 32
word count 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 128KX8 128KX8 128KX8 128KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSSOP TFBGA TSOP2 SOJ
Encapsulate equivalent code TSSOP32,.56,20 BGA36,6X8,30 TSOP32,.46 SOJ32,.34
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.25 mm 1.2 mm 1.2 mm 3.56 mm
Maximum standby current 0.00002 A 0.00002 A 0.00002 A 0.00002 A
Minimum standby current 2.5 V 2.5 V 2.5 V 2.5 V
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING BALL GULL WING J BEND
Terminal pitch 0.5 mm 0.75 mm 1.27 mm 1.27 mm
Terminal location DUAL BOTTOM DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8 mm 6 mm 10.16 mm 7.62 mm
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