|
IDT70V05L35F |
IDT70V05L55F |
IDT70V05S55F |
IDT70V05S25F |
IDT70V05L25F |
IDT70V05S35F |
| Description |
Multi-Port SRAM, 8KX8, 35ns, CMOS, CQFP68, QFP-68 |
Multi-Port SRAM, 8KX8, 55ns, CMOS, CQFP68, QFP-68 |
Multi-Port SRAM, 8KX8, 55ns, CMOS, CQFP68, QFP-68 |
Multi-Port SRAM, 8KX8, 25ns, CMOS, CQFP68, QFP-68 |
Multi-Port SRAM, 8KX8, 25ns, CMOS, CQFP68, QFP-68 |
Multi-Port SRAM, 8KX8, 35ns, CMOS, CQFP68, QFP-68 |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
| Parts packaging code |
QFP |
QFP |
QFP |
QFP |
QFP |
QFP |
| package instruction |
QFF, |
QFF, |
QFF, |
QFF, |
QFP-68 |
QFP-68 |
| Contacts |
68 |
68 |
68 |
68 |
68 |
68 |
| Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Maximum access time |
35 ns |
55 ns |
55 ns |
25 ns |
25 ns |
35 ns |
| Other features |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
| JESD-30 code |
S-CQFP-F68 |
S-CQFP-F68 |
S-CQFP-F68 |
S-CQFP-F68 |
S-CQFP-F68 |
S-CQFP-F68 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| length |
24.0792 mm |
24.0792 mm |
24.0792 mm |
24.0792 mm |
24.0792 mm |
24.0792 mm |
| memory density |
65536 bit |
65536 bit |
65536 bit |
65536 bit |
65536 bit |
65536 bit |
| Memory IC Type |
MULTI-PORT SRAM |
MULTI-PORT SRAM |
MULTI-PORT SRAM |
MULTI-PORT SRAM |
MULTI-PORT SRAM |
MULTI-PORT SRAM |
| memory width |
8 |
8 |
8 |
8 |
8 |
8 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of ports |
2 |
2 |
2 |
2 |
2 |
2 |
| Number of terminals |
68 |
68 |
68 |
68 |
68 |
68 |
| word count |
8192 words |
8192 words |
8192 words |
8192 words |
8192 words |
8192 words |
| character code |
8000 |
8000 |
8000 |
8000 |
8000 |
8000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
| organize |
8KX8 |
8KX8 |
8KX8 |
8KX8 |
8KX8 |
8KX8 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Exportable |
YES |
YES |
YES |
YES |
YES |
YES |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
QFF |
QFF |
QFF |
QFF |
QFF |
QFF |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
FLATPACK |
FLATPACK |
FLATPACK |
FLATPACK |
FLATPACK |
FLATPACK |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
225 |
225 |
225 |
225 |
225 |
225 |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
3.683 mm |
3.683 mm |
3.683 mm |
3.683 mm |
3.683 mm |
3.683 mm |
| Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
| Minimum supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
| Terminal form |
FLAT |
FLAT |
FLAT |
FLAT |
FLAT |
FLAT |
| Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
30 |
30 |
30 |
30 |
30 |
30 |
| width |
24.0792 mm |
24.0792 mm |
24.0792 mm |
24.0792 mm |
24.0792 mm |
24.0792 mm |