IDT70V05S35F datasheet, PDF - EEWORLD Datasheet

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IDT70V05S35F: DescriptionMulti-Port SRAM, 8KX8, 35ns, CMOS, CQFP68, QFP-68; Categorystorage storage; File Size633KB，17 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT70V05S35F Overview

Multi-Port SRAM, 8KX8, 35ns, CMOS, CQFP68, QFP-68

IDT70V05S35F Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	QFP
package instruction	QFP-68
Contacts	68
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	35 ns
Other features	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
JESD-30 code	S-CQFP-F68
JESD-609 code	e0
length	24.0792 mm
memory density	65536 bit
Memory IC Type	MULTI-PORT SRAM
memory width	8
Number of functions	1
Number of ports	2
Number of terminals	68
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFF
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
Maximum seat height	3.683 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	24.0792 mm

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IDT70V05S35F Related Products

	IDT70V05S35F	IDT70V05L55F	IDT70V05S55F	IDT70V05S25F	IDT70V05L35F	IDT70V05L25F
Description	Multi-Port SRAM, 8KX8, 35ns, CMOS, CQFP68, QFP-68	Multi-Port SRAM, 8KX8, 55ns, CMOS, CQFP68, QFP-68	Multi-Port SRAM, 8KX8, 55ns, CMOS, CQFP68, QFP-68	Multi-Port SRAM, 8KX8, 25ns, CMOS, CQFP68, QFP-68	Multi-Port SRAM, 8KX8, 35ns, CMOS, CQFP68, QFP-68	Multi-Port SRAM, 8KX8, 25ns, CMOS, CQFP68, QFP-68
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	QFP-68	QFF,	QFF,	QFF,	QFF,	QFP-68
Contacts	68	68	68	68	68	68
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	35 ns	55 ns	55 ns	25 ns	35 ns	25 ns
Other features	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
JESD-30 code	S-CQFP-F68	S-CQFP-F68	S-CQFP-F68	S-CQFP-F68	S-CQFP-F68	S-CQFP-F68
JESD-609 code	e0	e0	e0	e0	e0	e0
length	24.0792 mm	24.0792 mm	24.0792 mm	24.0792 mm	24.0792 mm	24.0792 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of ports	2	2	2	2	2	2
Number of terminals	68	68	68	68	68	68
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFF	QFF	QFF	QFF	QFF	QFF
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.683 mm	3.683 mm	3.683 mm	3.683 mm	3.683 mm	3.683 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	30	30	30	30
width	24.0792 mm	24.0792 mm	24.0792 mm	24.0792 mm	24.0792 mm	24.0792 mm

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