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IS61LV10248-12T

Description
Standard SRAM, 1MX8, 12ns, CMOS, PDSO44, TSOP2-44
Categorystorage    storage   
File Size48KB,12 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
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IS61LV10248-12T Overview

Standard SRAM, 1MX8, 12ns, CMOS, PDSO44, TSOP2-44

IS61LV10248-12T Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSOP2
package instructionTSOP2-44
Contacts44
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time12 ns
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length18.415 mm
memory density8388608 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals44
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX8
Package body materialPLASTIC/EPOXY
encapsulated codeLSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.2044 mm
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm

IS61LV10248-12T Preview

IS61LV10248
1M x 8 HIGH-SPEED CMOS STATIC RAM
FEATURES
• High-speed access times:
8, 10, 12 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for
greater noise immunity
• Easy memory expansion with
CE
and
OE
options
CE
power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single 3.3V power supply
• Packages available:
– 48-ball miniBGA (9mm x 11mm)
– 36-ball miniBGA (9mm x 11mm)
– 44-pin TSOP (Type II)
ISSI
®
PRELIMINARY INFORMATION
NOVEMBER 2002
DESCRIPTION
The
ISSI
IS61LV10248 is a very high-speed, low power,
1M-word by 8-bit CMOS static RAM. The IS61LV10248 is
fabricated using
ISSI
's high-performance CMOS technol-
ogy. This highly reliable process coupled with innovative
circuit design techniques, yields higher performance and
low power consumption devices.
When
CE
is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down to 250 µW (typical) with CMOS input levels.
The IS61LV10248 operates from a single 3.3V power
supply and all inputs are TTL-compatible.
The IS61LV10248 is available in 48 ball mini BGA, 36-ball
mini BGA, and 44-pin TSOP (Type II) packages.
FUNCTIONAL BLOCK DIAGRAM
A0-A19
DECODER
1M X 8
MEMORY ARRAY
VCC
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CE
OE
WE
CONTROL
CIRCUIT
Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
11/18/02
1
IS61LV10248
ISSI
48-pin Mini BGA (M ) (9mm x 11mm)
1
2
3
4
5
6
®
PIN CONFIGURATION
36 mini BGA (B) (9mm x 11mm)
1
2
3
4
5
6
A
B
C
D
E
F
G
H
A0
I/O4
I/O5
GND
Vcc
I/O6
I/O7
A9
A1
A2
NC
WE
A19
A3
A4
A5
A6
A7
A8
I/O0
I/O1
Vcc
GND
A
B
C
D
E
F
G
H
NC
NC
NC
GND
Vcc
NC
NC
A18
OE
NC
NC
NC
NC
NC
NC
A8
A0
A3
A5
A17
NC
A14
A12
A9
A1
A4
A6
A7
A16
A15
A13
A10
A2
CE
I/O1
I/O3
I/O4
I/O5
WE
A11
NC
I/O0
I/O2
Vcc
GND
I/O6
I/O7
A19
A18
OE
A10
CE
A11
A17
A16
A12
A15
A13
I/O2
I/O3
A14
PIN DESCRIPTIONS
A0-A19
CE
OE
WE
I/O0-I/O7
Vcc
GND
NC
Address Inputs
Chip Enable Input
Output Enable Input
Write Enable Input
Data Input / Output
Power
Ground
No Connection
44-pin TSOP (Type II )
NC
NC
A0
A1
A2
A3
A4
CE
I/O0
I/O1
Vcc
GND
I/O2
I/O3
WE
A5
A6
A7
A8
A9
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
NC
A18
A17
A16
A15
OE
I/O7
I/O6
GND
Vcc
I/O5
I/O4
A14
A13
A12
A11
A10
A19
NC
NC
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
11/18/02
IS61LV10248
ISSI
CE
H
L
L
L
OE
X
H
L
X
I/O Operation Vcc Current
High-Z
High-Z
D
OUT
D
IN
I
SB
1
, I
SB
2
I
CC
I
CC
I
CC
®
TRUTH TABLE
Mode
WE
Not Selected
X
(Power-down)
Output Disabled H
Read
H
Write
L
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
TERM
Vcc
T
STG
P
T
Parameter
Terminal Voltage with Respect to GND
Vcc Relates to GND
Storage Temperature
Power Dissipation
Value
–0.5 to Vcc + 0.5
–.3 to 4.0
–65 to +150
1.0
Unit
V
V
°C
W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage
to the device. This is a stress rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect reliability.
OPERATING RANGE
Range
Commercial
Industrial
Ambient Temperature
0°C to +70°C
–40°C to +85°C
V
CC
3.3V +10%, -5%
3.3V +10%, -5%
CAPACITANCE
(1,2)
Symbol
C
IN
C
I/O
Parameter
Input Capacitance
Input/Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Max.
6
8
Unit
pF
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: T
A
= 25°C, f = 1 MHz, Vcc = 3.3V.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
11/18/02
3
IS61LV10248
ISSI
Test Conditions
V
CC
= Min., I
OH
= –4.0 mA
V
CC
= Min., I
OL
= 8.0 mA
Min.
2.4
2.2
–0.3
GND
V
IN
V
CC
GND
V
OUT
V
CC
, Outputs Disabled
Com.
Ind.
Com.
Ind.
–1
–5
–1
–5
Max.
0.4
V
CC
+ 0.3
0.8
1
5
1
5
V
V
V
V
µA
µA
®
DC ELECTRICAL CHARACTERISTICS
(Over Operating Range)
Symbol Parameter
V
OH
V
OL
V
IH
V
IL
I
LI
I
LO
Note:
1. V
IL
= –3.0V for pulse width less than 10 ns.
Unit
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
(1)
Input Leakage
Output Leakage
POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range)
Symbol
I
CC
I
SB
1
Parameter
Vcc Dynamic Operating
Supply Current
TTL Standby Current
(TTL Inputs)
CMOS Standby
Current (CMOS Inputs)
Test Conditions
V
CC
= Max.,
Com.
I
OUT
= 0 mA, f = f
MAX
Ind.
V
CC
= Max.,
V
IN
= V
IH
or V
IL
CE
V
IH
, f = 0
Com.
Ind.
-8
Min. Max.
110
120
30
35
20
25
-10
Min. Max.
100
110
30
35
20
25
-12
Min. Max.
90
100
30
35
20
25
Unit
mA
mA
I
SB
2
V
CC
= Max.,
Com.
CE
V
CC
– 0.2V,
Ind.
V
IN
V
CC
– 0.2V, or
V
IN
0.2V, f = 0
mA
Note:
1.
At f = f
MAX
, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
4
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
11/18/02
IS61LV10248
ISSI
-8
Min. Max.
8
3
0
3
0
8
8
3.5
3
3
8
-10
Min. Max.
10
3
0
0
3
0
10
10
4
4
4
10
-12
Min. Max.
12
3
0
0
3
0
12
12
5
5
6
12
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
®
READ CYCLE SWITCHING CHARACTERISTICS
(1)
(Over Operating Range)
Symbol
Parameter
Read Cycle Time
Address Access Time
Output Hold Time
CE
Access Time
OE
Access Time
OE
to High-Z Output
OE
to Low-Z Output
CE
to High-Z Output
CE
to Low-Z Output
Power Up Time
Power Down Time
t
RC
t
AA
t
OHA
t
ACE
t
DOE
t
HZOE
(2)
t
LZOE
(2)
t
HZCE
(2
t
LZCE
(2)
t
PU
t
PD
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of
1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-stat voltage.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
11/18/02
5

IS61LV10248-12T Related Products

IS61LV10248-12T IS61LV10248-10M IS61LV10248-10MI IS61LV10248-12TI IS61LV10248-8MI IS61LV10248-10B
Description Standard SRAM, 1MX8, 12ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 1MX8, 10ns, CMOS, PBGA48, 9 X 11 MM, MINI, BGA-48 Standard SRAM, 1MX8, 10ns, CMOS, PBGA48, 9 X 11 MM, MINI, BGA-48 Standard SRAM, 1MX8, 12ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 1MX8, 8ns, CMOS, PBGA48, 9 X 11 MM, MINI, BGA-48 Standard SRAM, 1MX8, 10ns, CMOS, PBGA36, 9 X 11 MM, MINI, BGA-36
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code TSOP2 BGA BGA TSOP2 BGA BGA
package instruction TSOP2-44 9 X 11 MM, MINI, BGA-48 9 X 11 MM, MINI, BGA-48 TSOP2-44 9 X 11 MM, MINI, BGA-48 9 X 11 MM, MINI, BGA-36
Contacts 44 48 48 44 48 36
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 12 ns 10 ns 10 ns 12 ns 8 ns 10 ns
JESD-30 code R-PDSO-G44 R-PBGA-B48 R-PBGA-B48 R-PDSO-G44 R-PBGA-B48 R-PBGA-B36
JESD-609 code e0 e0 e0 e0 e0 e0
length 18.415 mm 11 mm 11 mm 18.415 mm 11 mm 11 mm
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 44 48 48 44 48 36
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 85 °C 85 °C 70 °C
organize 1MX8 1MX8 1MX8 1MX8 1MX8 1MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSSOP TFBGA TFBGA LSSOP TFBGA LFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2044 mm 1.2 mm 1.2 mm 1.2044 mm 1.2 mm 1.35 mm
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING BALL BALL GULL WING BALL BALL
Terminal pitch 0.8 mm 0.75 mm 0.75 mm 0.8 mm 0.75 mm 0.75 mm
Terminal location DUAL BOTTOM BOTTOM DUAL BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10.16 mm 9 mm 9 mm 10.16 mm 9 mm 9 mm
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