MT9HVF12872RHY-800XX datasheet, PDF

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MT9HVF12872RHY-800XX: DescriptionDDR DRAM Module, 128MX72, CMOS, LEAD FREE, SORDIMM-200; Categorystorage storage; File Size565KB，22 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT9HVF12872RHY-800XX Overview

DDR DRAM Module, 128MX72, CMOS, LEAD FREE, SORDIMM-200

MT9HVF12872RHY-800XX Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	MODULE
package instruction	DIMM,
Contacts	200
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N200
JESD-609 code	e4
memory density	9663676416 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	200
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128MX72
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Gold (Au)
Terminal form	NO LEAD
Terminal location	DUAL
Maximum time at peak reflow temperature	30

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512MB, 1GB (x72, ECC, SR): 200-Pin DDR2 SDRAM VLP SORDIMM

Features

DDR2 SDRAM VLP SORDIMM

MT9HVF6472RH – 512MB

MT9HVF12872RH – 1GB

For component data sheets, refer to Micron’s Web site:

www.micron.com

Features

• 200-pin, very low-profile (ATCA compatible), small-

outline registered dual in-line memory module (VLP

SORDIMM)

• Fast data transfer rates: PC2-3200, PC2-4200,

PC2-5300, or PC2-6400

• 512MB (64 Meg x 72), 1GB (128 Meg x 72)

• Supports ECC error detection and correction

• Vdd = Vddq = +1.8V

• Vddspd = +3.0V to +3.6V

• JEDEC-standard 1.8V I/O (SSTL_18-compatible)

• Differential data strobe (DQS, DQS#) option

• 4n-bit prefetch architecture

• Multiple internal device banks for concurrent

operation

• Programmable CAS# latency (CL)

• Posted CAS additive latency (AL)

• WRITE latency = READ latency - 1

• Programmable burst lengths: 4 or 8

• Adjustable data-output drive strength

• 64ms, 8192-cycle refresh

• On-die termination (ODT)

• Serial presence-detect (SPD) with EEPROM

• PLL to reduce system clock line loading

• Gold edge contacts

• Single rank

• I

C temperature sensor

Figure 1:

200-Pin VLP SORDIMM

(ATCA Compatible)

PCB height: 17.9mm (0.70in)

Options

• Operating temperature

–

Commercial (0°C

≤

+70°C)

–

Industrial (–40°C

≤

+85°C)

• Package

–

200-pin DIMM (lead-free)

• Frequency/CAS latency

–

2.5ns @ CL = 5 (DDR2-800)

–

2.5ns @ CL = 6 (DDR2-800)

–

3.0ns @ CL = 5 (DDR2-667)

–

3.75ns @ CL = 4 (DDR2-533)

–

5.0ns @ CL = 3 (DDR2-400)

• PCB height

–

17.9mm (0.70in)

Marking

None

-80E

-800

-667

-53E

-40E

Notes: 1. Contact Micron for industrial temperature

module offerings.

2. CL = CAS (READ) latency; registered mode

will add one clock cycle to CL.

3. Not recommended for new designs.

Table 1:

Speed

Grade

-80E

-800

-667

-53E

-40E

Key Timing Parameters

Industry

Nomenclature

PC2-6400

PC2-5300

PC2-4200

PC2-3200

Data Rate (MT/s)

CL = 6

–

800

–

CL = 5

800

667

–

CL = 4

533

400

CL = 3

–

400

RCD

(ns)

12.5

(ns)

12.5

(ns)

PDF: 09005aef82882ca3/Source: 09005aef82882c52

HVF9C64_128x72RH.fm - Rev. C 1/09 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

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