DM74LS471V datasheet, PDF - EEWORLD Datasheet

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DM74LS471V: Description256X8 OTPROM, 60ns, PQCC20, PLASTIC, LCC-20; Categorystorage storage; File Size115KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74LS471V Overview

256X8 OTPROM, 60ns, PQCC20, PLASTIC, LCC-20

DM74LS471V Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	QLCC
package instruction	QCCJ, LDCC20,.4SQ
Contacts	20
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	60 ns
JESD-30 code	S-PQCC-J20
JESD-609 code	e0
length	8.89 mm
memory density	2048 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	20
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC20,.4SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	8.89 mm

DM74LS471V Related Products

	DM74LS471V	DM74LS471N	DM74LS471J
Description	256X8 OTPROM, 60ns, PQCC20, PLASTIC, LCC-20	256X8 OTPROM, 60ns, PDIP20, PLASTIC, DIP-20	256X8 OTPROM, 60ns, CDIP20, CERAMIC, DIP-20
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	QLCC	DIP	DIP
package instruction	QCCJ, LDCC20,.4SQ	DIP, DIP20,.3	DIP, DIP20,.3
Contacts	20	20	20
Reach Compliance Code	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99
Maximum access time	60 ns	60 ns	60 ns
JESD-30 code	S-PQCC-J20	R-PDIP-T20	R-GDIP-T20
JESD-609 code	e0	e0	e0
length	8.89 mm	26.075 mm	24.51 mm
memory density	2048 bit	2048 bit	2048 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8
Number of functions	1	1	1
Number of terminals	20	20	20
word count	256 words	256 words	256 words
character code	256	256	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	256X8	256X8	256X8
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	QCCJ	DIP	DIP
Encapsulate equivalent code	LDCC20,.4SQ	DIP20,.3	DIP20,.3
Package shape	SQUARE	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	5.08 mm	5.08 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL
width	8.89 mm	7.62 mm	7.62 mm

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