PD - 90380
PROVISIONAL
SMPS MOSFET
Applications
l
Switch Mode Power Supply (SMPS)
l
Uninterruptible Power Supply
l
High Speed Power Switching
Benefits
l
Low Gate Charge Qg Reduces Drive
Required
l
Improved Gate Resistance for Faster
Switching
l
Fully Characterized Capacitance and
Avalanche Voltage and Current
l
Lowest Conduction Loss in Package
Outline
l
Effective C
OSS
specified (See AN 1001)
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
V
GS
dv/dt
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Recommended clip force
IRFPS59N60C
HEXFET
®
Power MOSFET
V
DSS
600V
R
DS(on)
max
0.045Ω
I
D
59A
Super-247™
Max.
59
37
240
390
3.1
± 20
TBD
-40 to + 150
-55 to + 150
300 (1.6mm from case )
20
Units
A
W
W/°C
V
V/ns
N
Applicable Off Line SMPS Topologies:
l
l
Power Factor Correction Boost
Full Bridge
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1
11/2/99
IRFPS59N60C
Static @ T
J
= 25°C (unless otherwise specified)
V
(BR)DSS
∆V
(BR)DSS
/∆T
J
R
DS(on)
V
GS(th)
I
DSS
I
GSS
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Min.
600
–––
–––
4.0
–––
–––
–––
–––
Typ.
–––
0.43
–––
–––
–––
–––
–––
–––
Max. Units
Conditions
–––
V
V
GS
= 0V, I
D
= 250µA
––– V/°C Reference to 25°C, I
D
= 1mA
0.045
Ω
V
GS
= 10V, I
D
= 35A
6.0
V
V
DS
= V
GS
, I
D
= 250µA
100
V
DS
= 600V, V
GS
= 0V
µA
500
V
DS
= 480V, V
GS
= 0V, T
J
= 125°C
100
V
GS
= 20V
nA
-100
V
GS
= -20V
Dynamic @ T
J
= 25°C (unless otherwise specified)
g
fs
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
C
oss
C
oss
C
oss
eff.
Parameter
Forward Transconductance
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
Min.
35
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
–––
–––
–––
33
110
86
18
10490
5140
280
24050
220
370
Max. Units
Conditions
–––
S
V
DS
= 50V, I
D
= 35A
490
I
D
= 35A
100
nC V
DS
= 360V
250
V
GS
= 10V
–––
V
DD
= 300V
–––
I
D
= 35A
ns
–––
R
G
= 1.0Ω
–––
R
D
= 8.5Ω
–––
V
GS
= 0V
–––
V
DS
= 25V
–––
pF
ƒ = 1.0MHz,
–––
V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
–––
V
GS
= 0V, V
DS
= 480V, ƒ = 1.0MHz
–––
V
GS
= 0V, V
DS
= 0V to 480V
Avalanche Characteristics
Parameter
E
AS
I
AR
E
AR
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Typ.
–––
–––
–––
Max.
TBD
35
39
Units
mJ
A
mJ
Thermal Resistance
Parameter
R
θJC
R
θCS
R
θJA
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Typ.
–––
0.24
–––
Max.
0.32
–––
40
Units
°C/W
Diode Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
D
MOSFET symbol
59
––– –––
showing the
A
G
integral reverse
––– ––– 240
S
p-n junction diode.
––– ––– 1.2
V
T
J
= 25°C, I
S
= 35A, V
GS
= 0V
––– 770 1150
ns
T
J
= 25°C, I
F
= 35A
––– 20
30
µC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
2
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IRFPS59N60C
Super-247™ Package Outline
Notes:
Repetitive rating; pulse width limited by
max. junction temperature.
Pulse width
≤
300µs; duty cycle
≤
2%.
Starting T
J
= 25°C, L = TBDmH
R
G
= 25Ω, I
AS
= 59A, dv/dt=TBD V/ns.
I
SD
≤
TBDA, di/dt
≤
TBDA/µs, V
DD
≤
V
(BR)DSS
,
T
J
≤
150°C
WORLD HEADQUARTERS:
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IR TAIWAN:16
Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: 886-2-2377-9936
Data and specifications subject to change without notice. 11/99
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3