EEWORLDEEWORLDEEWORLD

Part Number

Search

5962-3829407MYA

Description
SRAM, 8KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32
Categorystorage    storage   
File Size147KB,11 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric View All

5962-3829407MYA Overview

SRAM, 8KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32

5962-3829407MYA Parametric

Parameter NameAttribute value
Parts packaging codeQFJ
package instructionQCCN, LCC32,.45X.55
Contacts32
Reach Compliance Codeunknow
ECCN code3A001.A.2.C
Maximum access time70 ns
I/O typeCOMMON
JESD-30 codeR-CQCC-N32
JESD-609 codee0
length13.97 mm
memory density65536 bi
Memory IC TypeOTHER SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals32
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize8KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height3.048 mm
Maximum standby current0.015 A
Minimum standby current4.5 V
Maximum slew rate0.105 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width11.43 mm
Base Number Matches1
HIGH-SPEED
4K x 8 DUAL-PORT
STATIC SRAM
Features
High-speed access
– Military: 25/35/45/55/70ns (max.)
– Industrial: 55ns (max.)
– Commercial: 20/25/35/45/55/70ns (max.)
Low-power operation
– IDT7134SA
Active: 700mW (typ.)
Standby: 5mW (typ.)
– IDT7134LA
Active: 700mW (typ.)
Standby: 1mW (typ.)
Fully asynchronous operation from either port
Battery backup operation—2V data retention
TTL-compatible; single 5V (±10%) power supply
Available in 48-pin DIP, LCC, Flatpack and 52-pin PLCC
Military product compliant to MIL-PRF-38535 QML
Industrial temperature range (–40°C to +85°C) is available for
selected speeds
IDT7134SA/LA
Description
x
x
x
x
x
x
x
x
The IDT7134 is a high-speed 4K x 8 Dual-Port Static RAM
designed to be used in systems where on-chip hardware port arbitration
is not needed. This part lends itself to those systems which cannot
tolerate wait states or are designed to be able to externally arbitrate or
withstand contention when both sides simultaneously access the
same Dual-Port RAM location.
The IDT7134 provides two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access
for reads or writes to any location in memory. It is the user’s responsibility
to ensure data integrity when simultaneously accessing the same
memory location from both ports. An automatic power down feature,
controlled by
CE,
permits the on-chip circuitry of each port to enter a
very low standby power mode.
Fabricated using IDT’s CMOS high-performance technology, these
Dual-Port typically operate on only 700mW of power. Low-power (LA)
versions offer battery backup data retention capability, with each port
typically consuming 200µW from a 2V battery.
The IDT7134 is packaged on either a sidebraze or plastic 48-pin
DIP, 48-pin LCC, 52-pin PLCC and 48-pin Flatpack. Military grade
product is manufactured in compliance with the latest revision of MIL-
PRF-38535 QML, making it ideally suited to military temperature
applications demanding the highest level of performance and reliability.
Functional Block Diagram
R/W
L
CE
L
R/W
R
CE
R
OE
L
I/O
0L
- I/O
7L
COLUMN
I/O
COLUMN
I/O
OE
R
I/O
0R
- I/O
7R
A
0L
- A
11L
LEFT SIDE
ADDRESS
DECODE
LOGIC
MEMORY
ARRAY
RIGHT SIDE
ADDRESS
DECODE
LOGIC
A
0R
- A
11R
2720 drw 01
JUNE 1999
1
DSC-2720/9
About Windows Messenger that comes with WINCE5.0
There is no Messenger on the development device. I added the Windows Messenger control to Platform Builder and created a system. I transferred the programs and files related to Messenger to the device...
lwhcc Embedded System
About wince bsp
If my library files are modified, I must clear them first and then build them, otherwise the modifications cannot be added to nk.nb0, which takes so much time that it makes me frustrated. If I use bui...
zhoulongshaxia Embedded System
How to switch from assembly to PICC
Because there are many cracked versions of HIDE-TECH PICC, HIDE PICC has more users than other PICCs, although its compilation efficiency is not the best. The best is CCS, but there is no cracked vers...
小瑞 Microchip MCU
CC3200 test NAT intranet penetration experiment process: UDP sends G-SENSOR data
Prepare to use CC3200 to test NAT intranet penetration experimentNeed to use UDP programmingFirst try to see if CC3200's UDP works well.Wrote an experiment to send BMA222 accelerometer data to the hos...
littleshrimp Wireless Connectivity
IQE adds silicon wafer types to address aerospace applications
IQE plc (Cardiff, Wales), a supplier of semiconductor wafer products and operating services, has added two new technologies to its manufacturing process. The two process technologies use strained sili...
clj2004000 PCB Design
How to add a network card driver to Linux for a network card with a built-in protocol stack
There are two main types of WIFI modules on the market: 1. Embedded environment: most of them come with protocol stack, interface I2C, UART, SPI 2. PC environment: no protocol stack, interface USB, SP...
lzwml Linux and Android

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2519  2691  1156  787  1488  51  55  24  16  30 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号